Title:
ADHESIVE RESIN COMPOSITION AND ITS LAMINATE
Document Type and Number:
Japanese Patent JPH11335497
Kind Code:
A
Abstract:
To obtain an adhesive resin composition having excellent sealability with a small amount of a tackifier, showing excellent adhesiveness to a resin not containing a polar group such as a polystyrene and its laminate.
This adhesive resin composition comprises 60-99 wt.% of a resin composition (C) composed of 5-99 wt.% of a resin composition (A) constituted 50-99 wt.% of an ethylene-α-olefin copolymer and 1-50 wt.% of a hydrogenated petroleum resin and 1-95 wt.% of a low-density polyethylene (B) and 1-40 wt.% of a resin (D) completely incompatible or partial incompatible with the resin composition (A) and the low-density polyethylene (B).
Inventors:
FURUSAWA NOBUO
SEKINE NORIMASA
UMEYAMA HIROSHI
SUZUTA MASAYOSHI
SEKINE NORIMASA
UMEYAMA HIROSHI
SUZUTA MASAYOSHI
Application Number:
JP14764198A
Publication Date:
December 07, 1999
Filing Date:
May 28, 1998
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B32B27/32; C08L23/06; C08L23/08; C08L57/02; C08L101/00; (IPC1-7): C08L23/06; B32B27/32; C08L23/08; C08L57/02; C08L101/00