Title:
ADHESIVE COMPOSITION, ADHESIVE FOR MASKING FILM USING THE SAME, AND ADHESIVE FILM FOR MASKING
Document Type and Number:
Japanese Patent JP2022102115
Kind Code:
A
Abstract:
To provide an adhesive composition which can be peeled with light force regardless of peeling speed when used as an adhesive, is less likely to cause contamination when peeled from an adherend, and can be used for an adhesive film for masking.SOLUTION: An adhesive composition contains an acrylic resin (A), in which the acrylic resin (A) is an acrylic resin obtained by copolymerization of a copolymerization component (a) containing an acrylate monomer (a1) having an alkyl group having 4 to 12 carbon atoms, an acrylate monomer (a2) having an alkyl group having 1 to 3 carbon atoms, and a 2-hydroxyethyl methacrylate monomer (a3), a content ratio of the acrylate monomer (a2) having the alkyl group having 1 to 3 carbon atoms in the copolymerization component (a) is 20 wt.% or more, and a content ratio of the 2-hydroxyethyl methacrylate monomer (a3) is 6 wt.% or more.SELECTED DRAWING: None
Inventors:
SHOJI TAEKO
OKABE TOSHITAKA
OKABE TOSHITAKA
Application Number:
JP2020216654A
Publication Date:
July 07, 2022
Filing Date:
December 25, 2020
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C09J133/08; C09J7/38; C09J133/14
Attorney, Agent or Firm:
Nishihiko Yasuhiko
井▲崎▼ 愛佳
Yuko Nishito
Shigeyasu Terao
井▲崎▼ 愛佳
Yuko Nishito
Shigeyasu Terao