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WO/2013/147268A1 |
[Problem] To provide a transmission line capable of deterring an insertion loss attributable to a skin depth. Also, to provide a value-added transmission line that utilizes said feature. [Solution] This transmission line comprises conduc...
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WO/2013/142294A1 |
A chip package includes a micro-link between components disposed on a substrate. The micro-link may be an ultra-short multi-conductor transmission line with shared reference planes that results in a distribution of impedance values. Furt...
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WO/2013/137669A1 |
Provided are a coil-based artificial atom for metamaterials, a metamaterial comprising the artificial atom, and a device comprising the metamaterial. The coil-based artificial atom for metamaterial according to the present invention comp...
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WO/2013/133122A1 |
The present invention is provided with: an MMIC (3) having a signal source (4) and a conductor pattern (33) connected to the signal source (4); a substrate on which a signal line and a GND are formed and onto which the MMIC (3) is mounte...
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WO/2013/133175A1 |
A three-dimensional meta-material (20) includes a plurality of unit cells (10) arranged periodically in three dimensions. Each unit cell (10) is provided with a dielectric resonator (1) disposed at the center thereof, a plurality of rod-...
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WO/2013/127561A1 |
The invention relates to a semiconductor module with an integrated circuit (14), a rewiring layer (38) for externally connecting the integrated circuit (14), and at least one waveguide (18) for radar signals that is integrated into the s...
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WO/2013/123667A1 |
Provided is a millimeter-wave waveguide communication system. The millimeter-wave waveguide communication system comprises: a clock component, at least two sets of millimeter-wave receiving/transmitting channels, wherein the clock compon...
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WO/2013/120572A1 |
The invention relates to an arrangement for data transmission between a first system component, in particular a stationary system component, and a mobile component that is movable relative to the first system component, wherein in partic...
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WO/2013/119181A1 |
A switch for controlling signal propagation between a first and second contact is proposed. This switch comprises a control mechanism configured to allow signal propagation between the first and second contacts when the switch is turned ...
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WO/2013/114508A1 |
An electromagnetic wave transmission device has an electrical power transmission device, and electrical power receiving devices (106a, 106b). The electrical power transmission device has: an AC power supply (101) equipped with a circuit ...
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WO/2013/114678A1 |
Disclosed is an insulation circuit comprising: a first pattern formed on a first layer of a substrate, that receives high-frequency signals; a second pattern formed on this first layer next to the first pattern and that outputs the high-...
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WO/2013/114507A1 |
Edge sections which define the shape of a planar surface comprise two long edges (108a, 108b) extending in parallel to each other, and two short edges (107, 109) having parallel sections which extend in parallel to each other. The two lo...
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WO/2013/112349A1 |
Provided is an assembly and process for isolating internal regions of an electromagnetic cavity from interfering electromagnetic radiation. The assembly includes a first portion defining a first electrically conducting broad wall (152) a...
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WO/2013/108687A1 |
The present invention pertains to a transmission line and a transmission method which enable multimode transmission, intended for electrical signals, to be easily conducted. A multimode waveguide, and a metal line, along which electrical...
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WO/2013/109376A1 |
A contactless connector (100) includes a first communication chip (118) configured to at least one of transmit and receive wireless RF signals, a second communication chip (124) configured to at least one of transmit and receive wireless...
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WO/2013/105777A1 |
The present invention relates to a high-frequency transmission line using a printed circuit board for multiband antenna performance improvement. According to the present invention, a first ground layer (110) extending in one direction an...
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WO/2013/103075A1 |
Provided are a high-frequency signal line and an electronic device capable of suppressing leakage of an electromagnetic field via an opening provided on a grounding conductor. A plurality of dielectric sheets (18) is stacked on a dielect...
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WO/2013/103253A1 |
The present invention relates to a printed circuit board having a shielding member for reducing dielectric loss. The printed circuit board of the present invention comprises: a first ground layer extending in one direction; a first diele...
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WO/2013/103130A1 |
Provided are a high-frequency transmission line and electrical device making it possible to reduce cross-talk between two intersecting signal lines, and making it possible to reduce the thickness of a portion where two signal lines inter...
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WO/2013/103129A1 |
Provided are a high-frequency transmission line and an electronic apparatus in which crosstalk between two intersecting signal lines can be reduced, and the thickness of a portion of a laminated body at which the two signal lines interse...
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WO/2013/101288A1 |
A device for coupling microwave signals with arbitrary phase shifts and power split ratios over broadband may comprise a first branch comprising a cascade of first stripline sections connected to one another. A second branch may comprise...
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WO/2013/094730A1 |
Provided is an oscillation circuit device making it possible to implement stable oscillation properties without increasing costs. An oscillation circuit device (1) has an amplifier circuit (22) configured on a main board (3), and a coupl...
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WO/2013/094471A1 |
Provided are a high frequency signal line path, which is easily used by being bent, and an electronic apparatus. A dielectric body (12) is configured by laminating a plurality of flexible dielectric sheets (18). A strip-like signal line ...
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WO/2013/080476A1 |
Provided is a communication sheet which is resistant to displacement of RFID tags, this resistance being achieved by improving polarization characteristics. The communication sheet (100) of the present invention is a communication sheet ...
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WO/2013/078976A1 |
The invention provides a planar waveguide, a waveguide filter and an antenna. The planar waveguide comprises a top layer printed circuit board (PCB) that is provided with a groove, a bottom layer PCB, a plurality of shielding metal piece...
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WO/2013/056519A1 |
The present invention relates to a wafer-level through-silicon via (TSV) transmission structure applicable to the microwave band and a manufacturing method thereof. A TSV transmission cable structure using a high-frequency alternative co...
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WO/2013/050361A1 |
The present invention is related to a device for generating waveguide modes for use in a feed horn of a satellite antenna system, said waveguide modes comprising at least one excitation mode of higher order than the fundamental mode, sai...
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WO/2013/044618A1 |
The present invention relates to the field of microstrip. The microstrip comprises a metal strip, a dielectric substrate, and a ground plate. The dielectric substrate consists of a glass microsphere-filled FR-4. The metal strip is arrang...
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WO/2013/039334A2 |
The present invention relates to a receiving band stop filter integrated transmitter waveguide. The present invention is characterized by a transmitter waveguide that includes: a band stop filter that allows only a desired form of signal...
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WO/2013/035888A1 |
Since wiring boards for minimizing noise cannot be made thinner, this wiring board is provided with a first wiring layer, an intermediate layer, and a second wiring layer, stacked in the sequence of the second wiring layer, the intermedi...
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WO/2013/032813A1 |
A phased array antenna includes a semiconductor wafer, with radio frequency (RF) circuitry fabricated on top side of the semiconductor wafer. There is an array of antenna elements above the top side of the semiconductor wafer, and a coax...
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WO/2013/029372A1 |
The present invention relates to the field of microstrip. Provided is a microstrip. The microstrip comprises a metal strip, a dielectric substrate, and a ground plate. The microstrip also comprises a metamaterial thin film. The metamater...
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WO/2013/029371A1 |
The present invention relates to the field of microstrip. Provided is a metamaterial-based microstrip. The microstrip comprises a metal strip, a dielectric substrate, and a ground plate. The dielectric substrate is a metamaterial substra...
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WO/2013/029375A1 |
The present invention relates to a microstrip. The microstrip comprises a metal strip, a dielectric substrate, and a ground plate, and is characterized in that: the dielectric substrate is formed by splicing a first substrate and a secon...
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WO/2013/027268A1 |
This electromagnetic wave propagation medium (1) has a structure in which an electromagnetic wave propagation space (4) is sandwiched from above and below by a planar conductor (2) and a planar conductor (3). Conductor (2) and conductor ...
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WO/2013/027409A1 |
A wiring board for a high frequency module is provided with a wiring section for high frequency transmission, and a solder resist layer formed upon the wiring section. The solder resist layer covers the wiring section such that there are...
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WO/2013/016928A1 |
Provided are an isotropic all dielectric metamaterial and a preparation method thereof. The isotropic all dielectric metamaterial prepared according to the preparation method comprises multiple stacked dielectric substrates. The dielectr...
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WO/2013/006941A1 |
A radio frequency amplification unit is provided. The radio frequency amplification unit comprises a main amplifier, wherein the main amplifier is operable to amplify a first portion of an input signal, an auxiliary amplifier, wherein th...
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WO/2013/003000A1 |
A MMIC (10) having: a substrate (18); a plurality of active and passive electrical elements (FET1, C1-C4, L1-L3,TEE) disposed on a top surface of the substrate; a plurality of coplanar waveguide transmission line sections (20a-d) dispose...
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WO/2012/177293A2 |
A transmission line RF applicator apparatus and method for coupling RF power to a plasma in a plasma chamber. The apparatus comprises an inner conductor and one or two outer conductors. The main portion of each of the one or two outer co...
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WO/2012/177345A1 |
A multiple conductor radio-frequency transmission line including a plurality of conductive traces, an input port, and at least one output port is disclosed. The input port includes a radio-frequency signal input line which is generally a...
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WO/2012/169944A1 |
It is presented a power amplifier assembly comprising; a radio frequency multi -order power amplifier comprising a circuit board; a grounding structure connected to the radio frequency multi -order power amplifier and comprising a recess...
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WO/2012/167466A1 |
A surface mount module (5) adapted for transfer of a microwave signal between the module and a motherboard is provided. The module comprising a substrate (6) with a first microstrip conductor (7) and a second microstrip conductor (9), wh...
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WO/2012/167465A1 |
The invention concerns a coupling arrangement (1) for transfer of a microwave signal, the arrangement (1) comprising: - a motherboard (2) comprising a substrate (3) with a microstrip conductor (4), and - a module (5) comprising a substra...
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WO/2012/165557A1 |
Provided is a high-frequency electrical signal transmission line wherein loss in the form of dips (S21) in transmission characteristics caused by wall vibration can be eliminated, the transmission line can be made smaller, and manufactur...
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WO/2012/161676A1 |
A suspended line resonator and a tunable filter comprising multiple suspended line resonators. A microstrip resonator and a tunable filter comprising multiple microstrip resonators. A suspended substrate resonator and a tunable filter co...
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WO/2012/129478A9 |
A broadband waveguide (10) incorporates various reflection suppression techniques to reduce reflections in signals communicated thereby. The waveguide includes one or more filaments (12) that each include a first and second end (14, 16)....
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WO/2012/140732A1 |
[Problem] To realize an ultra-high frequency differential circuit having flat delay characteristics and right-tilt delay characteristics while principally having distributed constant lines. [Solution] An ultra-high frequency differential...
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WO/2012/126871A1 |
The subject of the invention is an RF component, comprising at least one coplanar RF stripline (Ls), with a metal area (M1, M2) on the surface of a substrate (S), and a nanoswitching structure located between said coplanar stripline and ...
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WO/2012/126250A1 |
Disclosed is an impedance matching component arranged between two dielectrics. The component is a single body formed by multiple uniform metamaterial lamellae stacked along the direction perpendicular to the lamella surface. The metamate...
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