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WO/2006/046515A1 |
Heat generated by an accumulator cell is dissipated by intermediate plates which sandwich a laminated body of an accumulator cell by each prescribed layer, and a laminating plane of each cell is pressed by a prescribed pressure by applyi...
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WO/2006/047771A1 |
Larger ceramic chip capacitors (101) are reliably mounted with minimal risk of flexure induced cracking on circuit boards by adding termination extensions (602, 602') to one face of the capacitor and soldering across all or part of the e...
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WO/2006/031281A2 |
An orientation-insensitive ultra-wideband coupling capacitor. The orientation insensitive ultra-wideband coupling capacitor (20) includes a plurality of external surfaces, a low frequency portion, and a high frequency portion. The high f...
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WO/2006/024257A1 |
The invention relates to a chip capacitor, comprising a substrate (1), provided on the underside thereof with external contacts (11) and on the upper side thereof with contact surfaces (12a, 12b). The chip capacitor comprises a capacitiv...
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WO/2006/022257A1 |
A ceramic electronic component having a structure in which a terminal member of a metal sheet is joined to an external electrode and excellent in mechanical shock resistance, heat-cycle performance, and current-resistance performance. A ...
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WO/2006/002615A2 |
The invention relates to an electric multi-layered component comprising ceramic dielectric layers which are stacked on top of each other between which component structures are arranged. The aim of the invention is to increase the mechani...
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WO/2005/124794A1 |
In an electronic component, on one surface of an insulating substrate (1), a circuit element and conductive balls (4) connected with circuit element terminals are arranged. The conductive balls (4) are surely fixed at desired positions o...
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WO/2005/120143A1 |
The present invention aims to supply an electronic component which is manufactured in a manufacturing process at low cost, and realize improvement of shock resistance, endurance, flexure resistance, mounting reliability etc. at the same ...
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WO/2005/116813A2 |
The present invention provides a multiple region vibration-sensing touch sensor that incorporates at least two sets of vibration sensors on a single touch plate, each set of vibration sensors defining distinct touch regions. The vibratio...
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WO/2005/114685A1 |
An electro-magnetic interference filter terminal assembly (136) for active implantable medical devices includes a structural pad (140) in the form of a substrate or attached wire bond pad (122), for convenient attachment of wires (124) f...
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WO/2005/106904A1 |
The invention relates to a capacitor with changeable dielectric properties, and a device for electric pulse modulation comprising such a capacitor, for instance an HPM source (High-Power Microwave, high-power microwave radiation). The in...
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WO/2005/093649A1 |
A method for computing using a quantum system (1540) comprising a plurality of superconducting qubits is provided. Quantum system (1540) can be in any one of at least two configurations including (i) an initialization Hamiltonian Ho and ...
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WO/2005/091976A2 |
The invention includes an electromagnetic filter for a feedthrough conductor, and a method of making such a filter. At least two dielectric components are supported from a first side of a substrate, such as a housing or a printed circuit...
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WO/2005/091398A1 |
Even if an electric device element with large thickness is sealed, no macrocracks are produced at the root of a fused portion of a packaging member. A film-packaged cell (10) comprises a cell element (13) to which leads (12a, 12b) are co...
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WO/2005/086189A1 |
The invention relates to a housing for high performance components, in particular high performance capacitors. According to the invention, a housing is produced comprising a support platform made from a suitable electrically-insulating m...
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WO/2005/083729A1 |
Disclosed is a solid electrolytic capacitor (A1) comprising a porous sintered body (1) composed of a valve metal, internal anode terminals (11a, 11b) projecting from the porous sintered body, and external anode terminals (21a, 21b) which...
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WO/2005/067045A1 |
An array capacitor is described for use with an integrated circuit (IC) mounted on an IC package. The array capacitor includes a number of first conductive layers (201, 203…) interleaved with a number of second conductive layers (202, ...
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WO/2005/064228A2 |
A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wi...
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WO/2005/062318A1 |
An electronic component, comprising a plurality of elements, pairs of terminal parts formed on the plurality of elements, and external materials covering parts of the elements and terminal parts. Non-conductive shielding parts are instal...
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WO/2005/062317A1 |
A wound capacitor has a lead configuration that enables enhanced control over equivalent series resistance (ESR) and equivalent series inductance (ESL). The capacitor has a case and a wound foil disposed within the case. A ball-and-lead ...
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WO/2005/057596A1 |
An electronic component which has a plurality of elements (1) , a pair of terminal parts (4) which are disposed on the element, and an armoring material (8) which covers the elements and a part of the terminal parts, and of such a config...
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WO/2005/055258A1 |
A solid electrolytic capacitor comprising a capacitor element (2), an anode lead terminal (3) electrically connected with the anode of the capacitor element, a cathode lead terminal (4) electrically connected with the cathode of the capa...
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WO/2005/052965A1 |
The invention relates to a method for applying a double sealing system to an electro-technical device and an electro-technical device with a double seal. Said Electro-technical device comprises ; a container (5) housing a functional unit...
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WO/2005/043970A1 |
According to the invention, the cooling capacity of an electronic component (4) may be improved with simple means, whereby the electronic component (4) is provided with a housing cup (2), produced by an extrusion method, the cup base (7)...
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WO/2005/038957A2 |
The inventive protective layer (7) consists of a metal or metal alloy absorbing important thermodynamic deformations without cracking and used for energy storage, in particular the metal or a metal alloy whose expansion ratio is lower th...
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WO/2005/022572A1 |
The invention relates to a circuit arrangement in the form of a module, comprising a chain of capacitors, preferably connected in series or dual-layer capacitors (C1, C2) that are located on a base plate (TP). The capacitors are permanen...
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WO/2005/008698A1 |
[PROBLEMS] To solve a problem with an appearance inspection method for the surface mounting type part (31) of a type shown in Fig. 18 wherein the method cannot be easily introduced in an actual production site due to its high cost since ...
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WO/2004/108994A2 |
An electrolytic cell and chamber for converting electric power into heat. The cell includes a non-conductive housing and a conductive end member sealingly positioned in and extending from each open end of the housing. The end members hav...
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WO/2004/105572A2 |
A feedthrough terminal assembly (36) for an active implantable medical device includes a conductive ferrule (12) conductively coupled to a housing (14) of the medical device, a feedthrough capacitor (40) conductively coupled to the ferru...
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WO/2004/096513A2 |
The invention relates to a metal-plastic composite component having a conductor comb for equipping with at least one electronic component. The at least one electronic component has at least one SMD component with stratiform electrical co...
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WO/2004/088688A1 |
A composite electronic component which can regulate a capacity to be delivered by the overlapping of inner-layer capacitor electrodes holding a dielectric sheet therebetween by changing the overlapped area of the inner-layer capacitor el...
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WO/2004/077466A1 |
A solid electrolytic capacitor comprises a capacitor element and a substrate on which the capacitor element is mounted. The capacitor element has a base composed of a valve metal and an anode and a cathode formed on the base. An anode le...
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WO/2004/068921A2 |
The invention relates to an electronic component (1) comprising at least one connection line (20), one end of which is configured as a press-fit contact (10) for pressing into a contact opening (40).
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WO/2004/053902A1 |
A metalized film capacitor small in size, large in capacity, and small in the number of parts and in inductance. The metalized film capacitor comprises a plurality of capacitor elements (1) each provided at the opposite ends, in the meta...
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WO/2004/034412A1 |
A metallized film capacitor has a slit (5a) almost at the center, in a width (W) direction, of an effective electrode portion contributing to the capacity formation of a pair of vapor-deposition electrodes (110, 210), and is provided, on...
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WO/2004/021378A1 |
Electrical component (1) having two connection leads (4-8) and comprising an impedance cell (2) electrically connected between the two connection leads, and a resistor (3). The electrical component (1) further comprises resistive materia...
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WO/2004/017342A1 |
Degradation and variation of wideband characteristics of a capacitor circuit where capacitors are parallel connected are suppressed. A capacitor (15) having electrodes (15a, 15b) on its top and bottom faces and a metal block (16) having ...
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WO/2004/013877A1 |
A capacitor element is manufactured by forming a dielectric film, a solid electrolyte layer and a cathode-side electrode film on an anode chip body of sintered valve-acting metal powder without causing decrease in effective volume of the...
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WO/2004/010756A2 |
The invention relates to a surface-mountable component comprising at least one outer connection (11, 12), individual components (21, 22) that are stacked together, and containing individual connections (311, 312, 321, 322), in which the ...
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WO/2004/000800A2 |
Electrochromic salts of dicationic viologens such as methyl viologen and benzyl viologen associated with anions selected from bis(trifluoromethylsulfonyl)imide, bis(perfluoroethylsulfonyl)imide, and tris(trifluoromethylsulfonyl)methide a...
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WO/2003/107367A1 |
A three-terminal solid electrolytic capacitor suitable to be built in a circuit board while reducing the ESL, a board with a built-in three-terminal solid electrolytic capacitor, and a method for producing them are disclosed. An electrod...
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WO/2003/107365A1 |
A solid electrolytic capacitor capable of reducing impedance, especially ESR and ESL, and a production method therefore. A cathode electrode (14) is provided on a surface-roughened aluminum foil substrate (2). One ends of aluminum foil s...
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WO/2003/102982A2 |
A method of making a double layer capacitor, in accordance with one embodiment, includes coupling a top collector disk (90) to a proximal end of a double layer capacitor electrode assembly (25); electrically coupling a bottom collector d...
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WO/2003/100800A1 |
A decoupling module for decoupling high-frequency signals from a power supply line, the module comprising a layer (30) of dielectric material which is arranged between a first and a second metallic layer (20, 22), where the first metalli...
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WO/2003/098647A2 |
The invention relates to a chip capacitor comprising at least two capacitor elements (1, 2), each of which is provided with an anode contact (21, 22) protruding from the capacitor element (1, 2), and a cathode contact (3). Said capacitor...
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WO/2003/098649A1 |
An electric double-layer capacitor wherein the port-sealing is effected by a flexible covering member adapted to reliably release the pressure at the time of internal pressure increase, the port-sealing being effected by the flexible cov...
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WO/2003/092023A1 |
The invention relates to a capacitor module (1) in which a first (10A) and a second capacitor (10B) are located in respectively separated, metallically conductive housings (5A, 5B) which are closed and sealed from each other. Said two ho...
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WO/2003/081611A1 |
A surface mounting chip network component in which a network having three or more odd number of terminals is formed on the surface of an insulating substrate and tomb stone phenomenon is suppressed. Even number of network circuits are fo...
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WO/2003/077268A1 |
A solid electrolytic capacitor comprising a capacitor element, and an insulating resin shell covering the capacitor element. The capacitor element comprises a part formed by winding an anode foil having a dielectric oxide film formed on ...
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WO/2003/058654A1 |
This invention relates to high ohm capacitor films and methods of making high ohm capacitor films. The capacitor films have a zinc active area and have a resistance specification of 20 ohms or higher. Corrosion of the zinc active area is...
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