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WO/2014/025416A1 |
An improved outer layer of plating comprising a binary metal alloy of gold and palladium is employed on connector contacts. The binary metal alloy is plated on at least the contact surface of the contacts. Intermediate plating layers can...
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WO/2014/022002A1 |
Systems and methods for tin antimony plating are provided. One plating method includes doping a tin (Sn) plating solution with antimony (Sb). One method also includes electroplating a component using the antimony-doped tin plating. The a...
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WO/2014/020981A1 |
Provided is an electrosilver plating bath yielding a semiglossy to glossy appearance across a wide current density range without the use of a cyan compound, and a plating method using the electrosilver plating bath. An electrosilver plat...
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WO/2014/017937A1 |
The present invention refers to an electrodeposition process of nickel-cobalt coatings (2), from aqueous solutions containing nickel and cobalt salts, by applying a pulsed waveform in the cathodic current range. It also refers to nickel-...
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WO/2014/010914A1 |
The present invention relates to a technology for substituting hexavalent chrome and to a technology for the electrolytic reduction of titanium in which an organosulphur compound is used as a reducing agent to reduce and precipitate tita...
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WO/2014/010301A1 |
A non-cyanide gold plating bath (1) contains: gold ions; and a compound represented by chemical formula (1).
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WO/2014/010915A1 |
The present invention is a technology for substituting hexavalent chrome and a technology for the electrolytic reduction of zirconium in which an organosulphur compound is used as a reducing agent to reduce and precipitate zirconium whic...
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WO/2014/007568A1 |
Provided is a nickel (Ni)-copper (Cu) plated high-carbon steel wire for springs. The Ni-Cu plated high-carbon steel wire includes a core wire that includes a high-carbon steel wire; and a Ni-plating layer and a Cu player which are sequen...
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WO/2014/008410A1 |
A process of producing metal that includes adding a quantity of a alkoxide (M(OR)x) or another metal salt to a cathode compartment of an electrolytic cell and electrolyzing the cell. This electrolyzing causes a quantity of alkali metal i...
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WO/2014/006031A1 |
The invention relates to a method for forming a passivation layer on a strip of packaging steel for producing a packaging container or a can, said strip having at least one tinplated surface having excellent sulphide staining resistance....
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WO/2014/001401A1 |
An article of manufacture includes a substrate having an outer surface clad with a metal construct including one or more continuous metal layers, at least one of which is an amorphous layer or a microcrystalline layer having a grain size...
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WO/2014/002028A1 |
Method of making a technical component of valves, of fittings or of tap assemblies comprising the steps of: (i) providing a metal substrate; (ii) electrodepositing a first layer of shiny copper on at least a portion of the metal substrat...
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WO/2013/191481A2 |
The present invention relates to a method for preparing a tin/silver alloy plating solution comprising methane sulfonic acid tin, methane sulfonic acid silver, methane sulfonic acid, a nonionic surfactant, and additives. The method compr...
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WO/2013/183348A1 |
Provided is a metallic material which permits ultrafine machining such as high-precision engraving or mirror-like finishing. This metallic material is an amorphous metallic material which comprises nickel as the main component, 10 to 20w...
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WO/2013/182631A1 |
The invention pertain to a method for electrochemical deposition of a metal coating on a metal substrate using an ionic liquid as the electrolyte,which substrate comprises a first metallic element which is the main component of said subs...
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WO/2013/181528A1 |
A method of producing a silicon film includes: forming a deposition composition comprising silicon dioxide dispersed in a molten salt; placing a metal substrate and a counter electrode in the composition; and passing a reducing current b...
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WO/2013/176796A1 |
A copper electroplating bath for producing copper electrodeposits is described, The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive compri...
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WO/2013/172673A1 |
The present invention relates to a complex reduced plating solution and to a plating method, in which a citric acid ion which is a link type reducing agent is used as substitute technology for hexavalent chrome to thus use a titanium ion...
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WO/2013/173008A1 |
A surface preparation solution comprises an ionic liquid solvent and a water and oxygen scavenging species. Methods for making the solution, and methods for using the solution to prepare and activate a substrate surface for bulk electrod...
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WO/2013/171026A1 |
The present invention relates to a method for producing a lithium electrode for a lithium-ion battery, comprising the method steps: a) providing a main body comprising an active material, particularly having metallic lithium, a lithium a...
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WO/2013/167779A1 |
The invention relates to a method for the synthesis of 3-(2-propinoxy)-2-propenoic acid or mixtures of said acid and propargylic alcohol by means of two consecutive electrolysis processes in the same electrolysis cell containing separati...
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WO/2013/164165A1 |
The invention relates to a composite material and to a corresponding method for producing said composite material. In particular, the present invention relates to composite materials that have a specific sequence of metals as a surface c...
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WO/2013/156737A1 |
The invention relates to a process for manufacturing an electrolytic bath for the production of a platinum-based metallic sublayer on a metallic substrate, which comprises the following steps: a) a first system comprising ligands and ami...
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WO/2013/157639A1 |
The present invention provides a copper-nickel alloy electroplating bath which is characterized by containing (a) a copper salt and a nickel salt, (b) a metal complexing agent, (c) a plurality of conductivity-imparting salts that are dif...
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WO/2013/154324A1 |
The composition of a plasma electrolysis oxidation solution for ceramic-coating the surface of a magnesium alloy product according to the present invention is obtained by mixing a basic solution produced by adding 1~30% by weight of sodi...
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WO/2013/150028A1 |
The present invention concerns a galvanic bath for the electrolytic deposition of a composite material based on gold, copper and cadmium, comprising gold, copper and cadmium as cyanide. The bath has a pH higher than 7, and further compri...
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WO/2012/129190A9 |
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WO/2013/143928A1 |
This invention relates to a coated substrate for packaging applications comprising a recrystallisation annealed single reduced steel substrate or a double reduced steel substrate which was subjected to recrystallisation annealing between...
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WO/2013/142765A1 |
The invention, concerns conductive coatings for use in the manufacture of for example, electrical connectors, LED arrays, and lead frames used in the computer industry. The coatings are composed of silver, antimony, and a protective laye...
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WO/2013/131784A1 |
The present invention relates to the use of certain thiourea compounds in a method for electrolytically depositing gold and gold alloys. The method is characterized in that higher gold deposition can be achieved in areas of low current d...
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WO/2013/129479A1 |
The present invention is characterized in that, in the preparation of a plating solution comprising at least (1) a dialkyl sulfone, (2) an aluminum halide and (3) a nitrogenated compound, the dialkyl sulfone, the aluminum halide and the ...
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WO/2013/125658A1 |
A metal material is provided with a metal material base (2) and a reforming layer formed on the surface of the metal material base (2), wherein the reforming layer has an average of three or more protrusions (3) in a 10 μm2 range, the p...
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WO/2013/122774A1 |
A method of adjusting and controlling the color of trivalent chromium deposits is provided. The method includes the steps of: (a) measuring the color of a trivalent chromium deposit standard; (b) adding one or more color enhancing additi...
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WO/2013/119322A1 |
Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate ...
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WO/2013/119062A1 |
The present invention relates to a copper plating solution for removing electro-plating stresses from an electrolytic copper plating film. According to the present invention, glycerin propoxylate ethoxylate is used in the electrolytic co...
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WO/2013/110361A1 |
An assembly adapted for connecting two ends of a steel cord (16) comprises a connector tubular fabric (10) for connecting steel cords at two non-overlapping connecting ends, the tubular fabric positioned so that it at least partially ove...
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WO/2013/109870A1 |
A zinc or steel substrate in the form of a blank or planchet is provided with a durable silvery "white" finish. A first layer of copper is applied over the substrate followed by a second electroplated layer of acid tin. The resulting sil...
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WO/2013/104877A1 |
The present invention provides an aqueous platinum electroplating bath comprising: a) a source of platinum ions; and b) a source of borate ions. The aqueous platinum electroplating bath may optionally comprise one or more levellers. The ...
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WO/2013/091738A1 |
Coins which consist of a steel core having an electrolytic covering layer composed of copper are internationally routine, e.g. the 1, 2 and 5 eurocent coins. Copper has the disadvantage that a matt patina is formed during use of the circ...
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WO/2013/092701A1 |
An aperture plate is formed from a palladium nickel alloy comprising about 89% palladium and about 11% nickel. There is a generally fine substantially equiaxed grain microstructure throughout the thickness of the aperture plate. The aver...
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WO/2013/092312A1 |
The present invention relates to a cyanide-free, pyrophosphate-containing electrolyte and a process for the electrolytic deposition of a ternary alloy of the elements copper, tin and zinc. The electrolyte and the process are characterize...
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WO/2013/092131A1 |
The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole (5) filling and filling of blind ...
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WO/2013/092314A1 |
The present invention relates to a cyanide-free, pyrophosphate-free and phosphonic acid-free electrolyte and a process for the electrolytic deposition of a ternary alloy of the elements copper, tin and zinc. The electrolyte and the proce...
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WO/2013/087268A1 |
The invention relates to a contact element for a solder-free electrical connection. The contact element has at least one contact section that is designed to produce an electrical contact, in particular by means of insulation displacement...
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WO/2013/085304A1 |
According to an aspect of the present invention, a method for preparing a tin-silver alloy plating solution including methanesulfonic tin, methanesulfonic silver, methanesulfonic acid, and an additive comprises: a first step of removing ...
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WO/2013/085698A2 |
A treated rotor is provided by a method in which a surface of a ferrous rotor having cooling elements is heat-treated to produce a microporous, outermost surface layer, then the heat-treated rotor is coated by electrodepositing a coating...
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WO/2013/071343A1 |
A method of depositing metal on an exposed surface of a p-type semiconductor region of a semiconductor device comprising a p-n junction is disclosed, the method comprising : immersing the exposed surface of the p-type semiconductor regio...
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WO/2013/066454A2 |
Al—Mnx/Al—Mny multilayers with a wide range of structures ranging from microcrystalline to nanocrystalline and amorphous were electrodeposited using a single bath method under galvanostatic control from room temperature ionic liquid....
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WO/2013/062026A1 |
This method for manufacturing a porous aluminum foil is characterized in comprising: forming a porous aluminum coating on the surface of a substrate by electrolysis using a plating solution including at least (1) a dialkyl sulfone, (2) a...
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WO/2013/053098A1 |
Disclosed are a delivery cylinder and a manufacturing method thereof, and pumping equipment comprising same. The delivery cylinder preparation method comprises the following steps: forming a first intermediate cylinder body by machining;...
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