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WO/2024/090446A1 |
This copper alloy powder for metal AM is used in metal AM and is composed of a copper alloy containing Cr and Zr, wherein a Cr compound layer having a Cr-containing compound is formed on the surface of the copper alloy particles constitu...
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WO/2024/090448A1 |
This copper alloy powder for metal AM is composed of a copper alloy containing Cr, and a Cr compound layer having a Cr-containing compound is formed on the surface of the copper alloy particles constituting the copper alloy powder.
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WO/2024/090450A1 |
This copper alloy powder for metal AM comprises a copper alloy containing Cr, Si, and Ni, and a CrSi-based compound containing Cr and Si, and/or an NiSi-based compound containing Ni and Si are precipitated on the copper crystal grain bou...
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WO/2024/090449A1 |
This metal AM copper alloy powder for use in metal additive manufacturing (AM) comprises a copper alloy containing Si. An Si-enriched layer is continuously formed on the surface of copper alloy particles of which the powder is composed.
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WO/2024/090037A1 |
Provided is a lead-free free-cutting beryllium copper alloy having excellent machinability. This lead-free free-cutting beryllium copper alloy comprises 1.80-2.10 wt% of Be, 0.10-3.00 wt% of Si, 0.20-0.40 wt% of Co, 0-0.10 wt% of Fe, and...
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WO/2024/090447A1 |
This method for manufacturing a copper alloy powder for metal AM has: a casting step for manufacturing a copper alloy ingot by means of a casting device provided with a molten copper feeding unit for melting a copper raw material compris...
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WO/2024/075521A1 |
Provided are copper particles having a carbon content of 0.1-2.5 mass% as calculated by the following method. [Method for calculating carbon content] The carbon content is calculated by weighing out 0.5 g of the copper particles, adding ...
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WO/2024/075797A1 |
Provided are a copper alloy that has improved corrosion resistance against stress corrosion cracking, and a copper alloy pipe and a heat exchanger in which said copper alloy is used. The copper alloy is a copper alloy in which a base met...
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WO/2024/071303A1 |
A copper powder comprising copper particle A and copper particle B, wherein the content of copper particle A is 60-99 mass% and the content of copper particle B is 1-40 mass% on the basis of the total amount of copper particle A and copp...
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WO/2024/071018A1 |
A brazing material for joining according to the present invention is for joining ceramics and metal and includes 31% by weight or more and less than 60% by weight of antimony (Sb) and 1% by weight to 5% by weight of titanium (Ti), the re...
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WO/2024/061010A1 |
A manganese-copper alloy having a negative temperature coefficient of resistance. The alloy comprises the following components in percentage by mass: 10% to 15% of Mn, 2% to 5% of Ni, 1% to 5% of an additive element X, and the balance of...
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WO/2024/058393A1 |
Provided are: an iron alloy having excellent manufacturability, exhibiting stable and high antibacterial property and having high mechanical properties; and a manufacturing method therefor. The iron alloy having an antibacterial property...
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WO/2024/058211A1 |
Provided is a copper bonding wire that makes it possible to improve cutting properties, bonding strength, and following properties, and to suppress wire lift-off and tool detachment. This copper wire is composed of a copper alloy having ...
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WO/2024/052221A1 |
The invention relates to a lead-free brass alloy, containing 55 to 59 wt % Cu, 2.0 to 2.5 wt % Mn, 0.65 to 1.5 wt % Si, less than 0.1 wt % Pb, and a remainder of Zn and unavoidable impurities. The invention additionally relates to a mach...
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WO/2024/053549A1 |
A probe comprising 40-95 mass% of Pt, 0.5-50 mass% of Cu, and 3-50 mass% of Ni.
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WO/2024/053552A1 |
The purpose of the present invention is to provide an alloy material for probe pins by which the diffusion of components of a probe material and solder at a circuit connection part to be tested during a probe test can be suppressed. Th...
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WO/2024/052220A1 |
The invention relates to a lead-free brass alloy, containing 59 to 62 wt % Cu, 2.0 to 2.5 wt % Mn, 0.5 to 1.5 wt % Si, less than 0.1 wt % Pb, and a remainder of Zn and unavoidable impurities. The invention additionally relates to a beari...
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WO/2024/032924A1 |
The invention relates to a wrought copper-zinc alloy for producing a wire-shaped, tubular or rod-shaped semi-finished product with the following composition in wt.%: Cu: 58.0 to 63.0%; Si: 0.04 to 0.32%; P: 0.05 to 0.20%; Sn: optionally ...
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WO/2024/034494A1 |
A copper alloy for sliding members according to the present disclosure, the copper alloy constituting a sliding layer (29), has a component composition which contains 0.4% by mass to 6% by mass of Mn, 0.3% by mass to 5% by mass of Fe, 0....
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WO/2024/032627A1 |
A preparation process for an anti-cracking high-aluminum-content dispersion-strengthened copper electrode material. The process flow is as follows: preparation of a high-aluminum dispersion copper powder ‑ preparation of an oxygen sour...
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WO/2024/032925A1 |
The invention relates to a casting material made of a copper-zinc alloy with the following composition in wt.%: Cu: 58.0 to 66.0 %, Si: 0.15 bis 1,2 %, P: 0.20 to 0.38 %, Sn: optionally up to 0.5 %, Al: optionally up to 0.05 %, Fe: optio...
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WO/2024/032923A1 |
The invention relates to a wrought copper-zinc alloy for producing a wire-, tube- or strand-type semi-finished product with the following composition, in wt.%: Cu: 58.0 to 66.0 %, Si: 0.15 to 1,2 %, P: 0.20 to 0.38 %, Sn: optionally up t...
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WO/2024/024898A1 |
A pure copper material according to the present invention has a Cu content within the range of 99.9 mass% to 99.999 mass%, while having an average crystal grain size of 10 μm or more in a rolled surface; and if a measurement area of 1 m...
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WO/2024/024899A1 |
A pure copper material according to the present invention has a Cu content within the range of 99.9 mass% to 99.999 mass%, while having an average crystal grain size of 10 μm or more in a rolled surface; and if a measurement area of 1 m...
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WO/2024/024909A1 |
This pure copper material has a Cu content of at least 99.96 mass%, wherein: the total amount of at least one or two group A elements selected from among Ca, Ba, Sr, Zr, Hf, Y, Sc, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, ...
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WO/2024/024709A1 |
The present invention provides: a cathode electrode that makes it possible to maintain, stably and with high efficiency over a long period, a catalytic reaction that produces an alcohol such as ethanol or an olefin-based hydrocarbon such...
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WO/2024/014172A1 |
Provided is a rolled copper foil that has higher flexibility than conventional products when made into an FPC. Rolled copper foil containing 99.9 mass% or more of Cu, the balance being unavoidable impurities, and the arithmetic mean valu...
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WO/2024/014171A1 |
Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper ...
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WO/2024/014429A1 |
Provided is a copper alloy material for heat-radiating components which, even after being subjected to a thermal history at high temperatures as a result of bonding such as brazing or welding, is capable of maintaining the rigidity of th...
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WO/2024/014057A1 |
PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device u...
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WO/2024/014170A1 |
Provided is a rolled copper foil which has bending properties superior to those of conventional rolled copper foils when made into an FPC. The rolled copper foil contains at least 99.9 mass% Cu, with the balance being unavoidable impurit...
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WO/2024/014091A1 |
Provided is a copper alloy sheet having: an alloy composition containing 0.10-1.00 mass% Cr, with the balance being copper and inevitable impurities; an average β-fiber (φ2=45°-90°) orientation density of 6.0-10.0, as measured using ...
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WO/2024/014168A1 |
Provided is a rolled copper foil that, when being formed into an FPC, has higher flexibility than conventional products. This rolled copper foil contains 99.9 mass% or more of Cu, and the remaining portion being unavoidable impurities, a...
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WO/2024/014173A1 |
Provided is a rolled copper foil having a higher flexibility than in the past when made into an FPC. This rolled copper foil contains 99.9 mass% or more of Cu, with the remainder made up by unavoidable impurities, and in the rolled coppe...
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WO/2024/014169A1 |
The present invention provides: a copper foil which has high resistance to folding by sliding or bending; and a copper-clad laminate and a flexible printed wiring board, each of which uses this copper foil. The present invention provides...
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WO/2024/014056A1 |
PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device u...
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WO/2024/009974A1 |
Provided is a joined body of an age-hardenable copper alloy in which an extremely high joining strength is achieved. The copper alloy joined body is constituted from a plurality of members of age-hardenable copper alloy diffusion-bonded ...
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WO/2024/009975A1 |
Provided is an age-hardenable copper alloy bonded body that achieves a very high bonding strength. This copper alloy bonded body is formed from a plurality of members that are made of an age-hardenable copper alloy and that are diffusion...
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WO/2024/009985A1 |
In recent years there have been problems with the durability and wear resistance of cam devices, when machining high-strength materials such as high-tensile steel which are often used in automotive panels; hence, the purpose of the prese...
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WO/2023/248642A1 |
A laminated bonding material 10 comprises a substrate 11, a first solder part 12a that is laminated on a first surface of the substrate 11, and a second solder part 12b that is laminated on a second surface of the substrate 11, wherein: ...
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WO/2023/238476A1 |
The present invention addresses the problem of providing an electrical-property-inspection conductor wire having high hardness and high conductivity. An electrical-property-inspection conductor wire for solving the aforementioned problem...
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WO/2023/239108A1 |
A wireless IC metal card, according to an embodiment of the present invention, comprises: a first metal layer having a top surface in which a wireless IC chip is accommodated; an antenna layer arranged on a partial region of the bottom s...
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WO/2023/238671A1 |
The present invention addresses the problem of providing a Cu-Ag alloy wire that simultaneously satisfies the hardness and specific resistance that are suitable for a probe pin. The Cu-Ag alloy wire that solves the abovementioned problem...
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WO/2023/223782A1 |
This sliding member is provided with a sliding film on at least the surface thereof. The sliding film contains copper-based alloy particles each containing titanium, in which a titanium oxide layer is provided on at least a portion of an...
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WO/2023/224218A1 |
The present invention relates to: a copper-nickel-silicon-manganese-tin (Cu-Ni-Si-Mn-Sn)-based copper alloy material having excellent strength, electrical conductivity, and bending workability; and a method for manufacturing same.
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WO/2023/223586A1 |
Provided is a copper powder from which an electrode having high density and continuality can be produced without requiring mixed use. The copper powder according to the present invention has a tap density of 4.2 g/cm3 to 5.5 g/cm3 inclus...
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WO/2023/218985A1 |
The present invention can provide a high-quality copper alloy additively-manufactured article. The present invention is a copper alloy powder for additive manufacturing, to be used for manufacturing an additively-manufactured object by a...
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WO/2023/217164A1 |
The present invention provides a device and method for preparing a low-impurity regenerated brass alloy through step-by-step electrode insertion, and belongs to the technical field of metal melt purification. The device comprises a melt ...
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WO/2023/207943A1 |
The present disclosure relates to a high-strength electromagnetic shielding copper alloy and a preparation method therefor, and belongs to the technical field of copper alloys. The alloy comprises the following chemical components in per...
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WO/2023/201684A1 |
The present application provides a porous material and a preparation method therefor, a current collector, a secondary battery and a device. The porous material has pores having a first pore diameter and pores having a second pore diamet...
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