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Title:
WOOD FLOOR COLLAPSE REPAIRING APPARATUS AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/108434
Kind Code:
A1
Abstract:
In order to solve the problems of waste of time and labor, waste of building materials, and environmental pollution of a traditional wood floor collapse repairing approach, provided is a wood floor collapse repairing apparatus, comprising a filler, a bag body, and a bag opening. The bag body can enter between a wood floor and the ground by means of a placement hole; after the bag body is expanded by the filler, the maximum width in the horizontal direction is greater than that of the placement hole; the filler passes through the bag opening via the placement hole to enter the bag body to expand the bag body and push up the wood floor, so as to repair collapse. Further provided is a collapsed wood floor repairing method, comprising: attracting a magnetic component in the apparatus by means of a magnet on the upper surface of the wood floor, and attracting the magnetic component to a second placement hole; guiding a second bag opening near the second placement hole; connecting a first bag opening and the second bag opening by means of a circulating pump to complete filler injection; adjusting filler capacity so that the height of the wood floor from the ground is consistent with the height of surrounding wood floors from the ground, and sealing the first bag opening and the second bag opening.

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Inventors:
QIAN CHONG (CN)
Application Number:
PCT/CN2021/138016
Publication Date:
June 22, 2023
Filing Date:
December 14, 2021
Export Citation:
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Assignee:
HANGZHOU DIANZI UNIV TECHNOLOGY (CN)
International Classes:
E04G23/02
Foreign References:
JP2012202047A2012-10-22
US4715151A1987-12-29
DE102012017243A12014-03-06
CN113152922A2021-07-23
JP2013155531A2013-08-15
KR20160142993A2016-12-14
CN109252692A2019-01-22
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