Title:
WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/009886
Kind Code:
A1
Abstract:
According to the present invention, an insulating layer has first and second main surfaces. A conductor layer is provided on the first main surface. A metal thin film is provided on the second main surface and has a third main surface facing the opposite direction from the insulating layer. A metal support is made from a metal material different from that of the metal thin film. In the first main surface, first and second areas are defined and the conductor layer forms a wire extending such as to pass through the first and second areas of the first main surface. When third and fourth areas are defined in the third main surface overlapping with the first and second areas in the first main surface in a plan view, the metal support is provided on the third main surface such as not to cover the third area and such as to cover the fourth area.
Inventors:
YAMAUCHI DAISUKE (JP)
OYABU YASUNARI (JP)
WATANABE RINA (JP)
OYABU YASUNARI (JP)
WATANABE RINA (JP)
Application Number:
PCT/JP2023/024194
Publication Date:
January 11, 2024
Filing Date:
June 29, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
G11B5/60; G11B5/48; G11B21/21; H05K1/02; H05K3/44
Foreign References:
| JP2007019261A | 2007-01-25 | |||
| JP2012243382A | 2012-12-10 | |||
| JP2011233213A | 2011-11-17 |
Attorney, Agent or Firm:
NAKAGAWA, Masahiro et al. (JP)
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