Title:
WIRE ELECTRICAL DISCHARGE MACHINING DEVICE, WIRE ELECTRICAL DISCHARGE MACHINING METHOD, AND WAFER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/243094
Kind Code:
A1
Abstract:
A wire electrical discharge machining device comprises: a pair of conductive machining fluid- rectifying plates that are connected to a power source and are provided to contact both sides of a workpiece so as to sandwich the workpiece; a pair of nozzles (7a, 7b) that have a plurality of machining fluid ejection holes (7c) through which a plurality of cutting wire parts (1b) are inserted and machining fluid is supplied to a gap between the plurality of cutting wire parts (1b) and the workpiece (W) by the machining fluid being ejected toward a space sandwiched between the pair of machining fluid-rectifying plates; a cutting feed stage that moves the pair of machining fluid-rectifying plates vertically relative to the plurality of cutting wire parts (1b); a workpiece pressing part (72) that holds the workpiece (W), which is to be divided during the cutting process, from above the workpiece (W) and the plurality of cutting wire parts (1b); and a conductive lower workpiece holding part that comes into contact with the workpiece (W) from below to hold the workpiece (W).
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Inventors:
MIYAKE HIDETAKA (JP)
Application Number:
PCT/JP2022/024397
Publication Date:
December 21, 2023
Filing Date:
June 17, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23H7/02
Domestic Patent References:
| WO2020213040A1 | 2020-10-22 |
Foreign References:
| JP6999865B1 | 2022-01-19 | |||
| JP2002205255A | 2002-07-23 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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