Title:
WATER-BASED DISPERSION FOR ELECTROMAGNETIC WAVE SHIELDING FILM FORMATION
Document Type and Number:
WIPO Patent Application WO/2024/090285
Kind Code:
A1
Abstract:
The present invention provides a novel water-based dispersion for electromagnetic wave shielding film formation that has good coating and adhesion to a resin substrate and that can form an electromagnetic wave shielding film having good electrical characteristics. This water-based dispersion for electromagnetic wave shield film formation contains water, carbon black, and a urethane dispersion. The ratio of the mass of particles of the polyurethane dispersion to the mass of the carbon black is 0.55-1.20.
Inventors:
IKAI TAKAYUKI (JP)
KADOHASHI KOUTA (JP)
KADOHASHI KOUTA (JP)
Application Number:
PCT/JP2023/037474
Publication Date:
May 02, 2024
Filing Date:
October 17, 2023
Export Citation:
Assignee:
MITSUBISHI PENCIL CO (JP)
International Classes:
C09D175/04; C08K3/04; C08L75/04; C09D5/02; C09D5/33; C09D7/61
Foreign References:
| JP2007503299A | 2007-02-22 | |||
| JPH0273512A | 1990-03-13 | |||
| JPS6295342A | 1987-05-01 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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