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Title:
WAFER SYSTEM, PREPARATION METHOD, PROCESSING METHOD, POWER SUPPLY METHOD, DEVICE AND MEDIUM
Document Type and Number:
WIPO Patent Application WO/2024/078510
Kind Code:
A1
Abstract:
The present disclosure relates to a wafer system, a preparation method, a processing method, a power supply method, a device and a medium. The wafer system comprises at least one wafer processing apparatus and an auxiliary function apparatus; the wafer processing apparatus is an apparatus prepared on the basis of wafers and used for executing a task to be processed, and the auxiliary function apparatus is an apparatus for providing an auxiliary function for the wafer processing apparatus.

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WO/2021/104791LITHOGRAPHY APPARATUS WITH IMPROVED STABILITY
Inventors:
HE WEI (CN)
ZHU YAOLONG (CN)
Application Number:
PCT/CN2023/123852
Publication Date:
April 18, 2024
Filing Date:
October 10, 2023
Export Citation:
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Assignee:
LYNXI TECH CO LTD (CN)
International Classes:
H01L21/687; G06F1/20; G06F30/392; H01L21/60; H01L21/67; H01L21/768; H01L21/82; H01L23/488; H01L23/49; H01L25/18; H01L27/04; H02J50/00; H02J50/20; H02J50/80; H10B80/00
Foreign References:
CN115617138A2023-01-17
CN116127900A2023-05-16
CN115954351A2023-04-11
CN115864682A2023-03-28
CN115602598A2023-01-13
CN114937658A2022-08-23
CN115050713A2022-09-13
CN114743956A2022-07-12
TW202028770A2020-08-01
TWM578800U2019-06-01
CN103715066A2014-04-09
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPER TY ATTORNEYS (CN)
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