Title:
UNDERLAYER FILM-FORMING COMPOSITION FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/021511
Kind Code:
A1
Abstract:
This underlayer film-forming composition for lithography contains a compound represented by specific formula (1) and 20 to 99 mass% of a solvent component (S), wherein the compound represented by formula (1) comprises 27 to 100 mass% of a component (A), which exists in addition to the solvent component (S).
Inventors:
OKADA KANA (JP)
MAKINOSHIMA TAKASHI (JP)
ECHIGO MASATOSHI (JP)
HIGASHIHARA GO (JP)
OKOSHI ATSUSHI (JP)
MAKINOSHIMA TAKASHI (JP)
ECHIGO MASATOSHI (JP)
HIGASHIHARA GO (JP)
OKOSHI ATSUSHI (JP)
Application Number:
PCT/JP2015/071855
Publication Date:
February 11, 2016
Filing Date:
July 31, 2015
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
G03F7/11; C07C261/02; G03F7/004; G03F7/26; H01L21/027
Domestic Patent References:
| WO2013036027A2 | 2013-03-14 | |||
| WO2009072465A1 | 2009-06-11 |
Foreign References:
| JP2006193607A | 2006-07-27 | |||
| JP2012212051A | 2012-11-01 | |||
| JP2010189470A | 2010-09-02 |
Other References:
See also references of EP 3179308A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
Yoshiyuki Inaba (JP)
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