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Title:
UNDERLAY
Document Type and Number:
WIPO Patent Application WO/2022/145230
Kind Code:
A1
Abstract:
Provided is an underlay with which handwriting defects can be improved and handwriting learning ability can be enhanced. This underlay comprises: a plastic substrate 1; and a plurality of protrusions 2 which are formed close together in an equal interval dot pattern on at least one surface of the substrate 1. The plurality of protrusions 2 are formed at intervals and with a height that allows a writing instrument to scan therethrough. The plurality of protrusions 2 are formed on the substrate 1 by thick raised printing. The plurality of protrusions 2 are arranged in an equilateral triangle-shaped mesh-like dense array. The plurality of protrusions 2 are formed inward on the substrate 1 excluding an outer peripheral edge 1a. Each protrusion 2 is formed in a truncated cone shape.

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Inventors:
TAKAHASHI JUNICHI (JP)
KAMOSHITA KENICHI (JP)
KODAMA TAKESHI (JP)
KANAYA KUNIHIRO (JP)
HIGASHIONNA TAKUYA (JP)
OGINO KEIJI (JP)
TAKAHASHI TOMONORI (JP)
TOZUKA KAYOKO (JP)
KAWASAKI MISAKI (JP)
Application Number:
PCT/JP2021/046249
Publication Date:
July 07, 2022
Filing Date:
December 15, 2021
Export Citation:
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Assignee:
OFFICE SUNNY CO LTD (JP)
International Classes:
B43L3/00
Domestic Patent References:
WO2012086482A12012-06-28
Foreign References:
JPS51112626A1976-10-05
US8313329B22012-11-20
JPS5989376U1984-06-16
JP3205468U2016-07-28
Attorney, Agent or Firm:
SAKIMA Nobuhiro et al. (JP)
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