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Title:
TWO-COMPONENT TYPE ROOM TEMPERATURE RAPID-CURABLE RESIN COMPOSITION AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2024/014350
Kind Code:
A1
Abstract:
This two-component type room temperature rapid-curable resin composition comprises, at a specific ratio: a first agent containing, at a specific ratio, (A) an organic polymer in which the molecule chain terminals are blocked by a hydrolysable silyl group and/or a hydroxyl silyl group, and in which an organopolysiloxane structure is not included in the polymer main chain, (B) a hydrolyzable organosilane compound represented by formula (1) (in formula (1), R1 represents a monovalent hydrocarbon group, n represents 1-8, and m represents 3 or 4) and/or a partial hydrolysis condensate thereof, and (C) a curing catalyst; and a second agent containing (A') an organic polymer in which the molecule chain terminals are blocked by a hydrolysable silyl group and/or a hydroxyl silyl group, and in which an organopolysiloxane structure is not included in the polymer main chain. The two-component type room temperature rapid-curable resin composition has excellent rapid curability and deep curability, provides fine workability, and, when being cured, causes elimination/release of a cyclic ketone compound such as cyclobutanone and cyclopentanone as a leaving group (elimination compound). Thus, the composition solves problems regarding safety and hazardous properties with respect to human and the environment.

Inventors:
UTA AKIRA (JP)
Application Number:
PCT/JP2023/024712
Publication Date:
January 18, 2024
Filing Date:
July 04, 2023
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L101/10; C08K3/013; C08K5/17; C08K5/5425; C09J201/10; C09K3/10
Domestic Patent References:
WO2023127675A12023-07-06
WO2022113437A12022-06-02
Foreign References:
JPH07118531A1995-05-09
JPH11246768A1999-09-14
JP2001303024A2001-10-31
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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