Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/057891
Kind Code:
A1
Abstract:
A thermoplastic resin composition containing a vinyl copolymer (A), obtained by copolymerizing a vinyl monomer mixture (ma) containing an aromatic vinyl monomer (a1) and a (meth)acrylic acid ester monomer (a2), a rubber-reinforced graft copolymer (B), obtained by graft copolymerizing at least an aromatic vinyl monomer (b1), a (meth)acrylic acid ester monomer (b2), and a vinyl cyanide monomer (b3) in the presence of a rubbery polymer (r), and a polyamide elastomer (C), wherein the vinyl copolymer (A) contains a vinyl copolymer (A1) having a weight average molecular weight of 50,000 to 300,000, obtained by copolymerizing a vinyl monomer mixture (ma1) containing an aromatic vinyl monomer (a1), a (meth)acrylic acid ester monomer (a2), and a vinyl cyanide monomer (a3), and the thermoplastic resin composition contains a total of 60 to 92 mass parts of the vinyl copolymer (A) and the rubber-reinforced graft copolymer (B) and 8 to 40 mass parts of the polyamide elastomer (C) per 100 total mass parts of the vinyl copolymer (A), rubber-reinforced graft copolymer (B), and polyamide elastomer (C).

Inventors:
SUGIMURA KEITARO (JP)
OOHASHI NAOTOSHI (JP)
Application Number:
PCT/JP2023/030921
Publication Date:
March 21, 2024
Filing Date:
August 28, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TECHNO UMG CO LTD (JP)
International Classes:
C08L33/08; C08L51/04; C08L77/00
Foreign References:
JP2017145365A2017-08-24
JP2021091836A2021-06-17
JPH02292353A1990-12-03
JP2006219643A2006-08-24
JP2016175971A2016-10-06
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
Download PDF: