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Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/034397
Kind Code:
A1
Abstract:
This thermoplastic resin composition contains the following components (A) and (B), wherein the mass percentage of the content X of a methyl methacrylate unit and the mass percentage of the content Y of the component (B) in 100 mass% of the total of the component (A) and the component (B) satisfy expression (1).　Expression (1): 0.1

Inventors:
OMATA YUUKI (JP)
Application Number:
PCT/JP2023/027312
Publication Date:
February 15, 2024
Filing Date:
July 26, 2023
Export Citation:
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Assignee:
TECHNO UMG CO LTD (JP)
International Classes:
C08L51/04; C08F265/06; C08F279/02; C08L33/12
Foreign References:
JP2007056140A2007-03-08
JP2007269838A2007-10-18
JP2000302937A2000-10-31
JP2000169656A2000-06-20
JP2000302934A2000-10-31
JPH10245483A1998-09-14
JPS5293465A1977-08-05
JPH08187306A1996-07-23
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
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