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Title:
THERMOELECTRIC CONVERSION MATERIAL LAYER AND THERMOELECTRIC CONVERSION MODULE
Document Type and Number:
WIPO Patent Application WO/2023/013590
Kind Code:
A1
Abstract:
The present invention provides a thermoelectric conversion material layer which exhibits high thermoelectric performance, wherein the electrical conductivity of a thermoelectric conversion material in the thermoelectric conversion material layer is further improved. This thermoelectric conversion material layer contains a thermoelectric conversion material that is composed of a thermoelectric semiconductor composition which contains thermoelectric semiconductor particles, a binder resin and an ionic liquid; and the average particle diameter of the thermoelectric semiconductor particles is not less than 8.0 µm but less than 50.0 µm.

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Inventors:
YAMASAKI TOSHIYA (JP)
KATO KUNIHISA (JP)
SEKI YUTA (JP)
Application Number:
PCT/JP2022/029511
Publication Date:
February 09, 2023
Filing Date:
August 01, 2022
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
H01L35/26; H01L35/16; H01L35/24; H01L35/34
Domestic Patent References:
WO2013141065A12013-09-26
WO2020203612A12020-10-08
WO2021124860A12021-06-24
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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