Title:
THERMALLY EXPANDABLE MICROCAPSULES
Document Type and Number:
WIPO Patent Application WO/2023/190294
Kind Code:
A1
Abstract:
The present invention provides: thermally expandable microcapsules which have excellent foamability, and which enable the achievement of a foam molded body having excellent flame retardancy; and a foamable masterbatch, a foamable resin composition, and a foam molded body, each of which uses the thermally expandable microcapsules. The present invention pertains to thermally expandable microcapsules each comprising a shell, and a volatile expanding agent enclosed as a core agent in the shell, wherein the shell contains a flame retardant.
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Inventors:
OBINATA SHUHEI (JP)
HOSHIYAMA YUUKI (JP)
WAKIYA TAKESHI (JP)
HOSHIYAMA YUUKI (JP)
WAKIYA TAKESHI (JP)
Application Number:
PCT/JP2023/012116
Publication Date:
October 05, 2023
Filing Date:
March 27, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08J9/32; C09K21/08; C08K9/10; C08L101/00; C09K3/00; C09K21/12
Domestic Patent References:
| WO2020158613A1 | 2020-08-06 |
Foreign References:
| CN108641033A | 2018-10-12 | |||
| JPH11323015A | 1999-11-26 | |||
| JPH02283766A | 1990-11-21 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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