THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF

WIPO Patent Application WO/2024/075319

A1

This thermally conductive silicone composition, which is a liquid silicone and is curable, comprises: (A-1) an organopolysiloxane which has an alkenyl group at each terminal of the molecular chain; (A-2) an organopolysiloxane which has an alkenyl group at one terminal of the molecular chain and does not have a reactive functional group at the other terminal of the molecular chain; (A-3) an organopolysiloxane which has three or more alkenyl groups per molecule; (A-4) an organohydrogenpolysiloxane which has a silicon atom–bonded hydrogen atom at a molecular chain terminal and does not have a silicon atom–bonded hydrogen atom in a side chain of the molecular chain; (B) a hydrosilylation catalyst; and (C) a thermally conductive filler.

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ASAMI TAKAHIRO (JP)

PCT/JP2023/003987

April 11, 2024

February 07, 2023

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FUKOKU KK (JP)

C08L83/07; C08K3/22; C08L83/05

WO2010013847A1	2010-02-04
WO2014181657A1	2014-11-13
WO2021016743A1	2021-02-04

JP2020512465A	2020-04-23
JP2016011322A	2016-01-21
JP2011016923A	2011-01-27

MIYAZAKI Teruo et al. (JP)

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