Title:
THERMALLY CONDUCTIVE SILICONE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/092554
Kind Code:
A1
Abstract:
The present invention provides a thermally conductive silicone adhesive composition comprising: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of at least two hydrogen atoms directly bonded to a silicon atom in one molecule; (C) a thermally conductive filler; (D) a silane coupling agent; and (E) a catalyst; wherein the component (D) is selected from the general formulae (i) to (iii) shown below and mixture thereof, in which in each formula, R1 independently represents a hydrogen or vinyl group, and R2 independently represents an alkyl group having 1 to 4 carbon atoms; and the component (D) is present in an amount of less than 1%by weight based on the total weight of the composition. The invention features favorable combination of properties including good flowability and high thermal conductivity when cured.
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Inventors:
ZHU XINGYU (CN)
CHANG JINGJING (CN)
LI DAN (CN)
CHEN YAN (CN)
CHEN XIAODAN (CN)
CHANG JINGJING (CN)
LI DAN (CN)
CHEN YAN (CN)
CHEN XIAODAN (CN)
Application Number:
PCT/CN2022/129257
Publication Date:
May 10, 2024
Filing Date:
November 02, 2022
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL CHINA CO LTD (CN)
HENKEL CHINA CO LTD (CN)
International Classes:
C09J183/07; C08K3/22; C08L83/05; C08L83/06; C08L83/07
Foreign References:
| US20200270500A1 | 2020-08-27 | |||
| US20200270499A1 | 2020-08-27 | |||
| US20220169799A1 | 2022-06-02 | |||
| JP2021187874A | 2021-12-13 |
Attorney, Agent or Firm:
NTD PATENT & TRADEMARK AGENCY LTD. (CN)
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