THERMALLY CONDUCTIVE MATERIAL AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2024/095510

A1

Provided is a thermally conductive material capable of achieving substantially isotropic high thermal conductivity. The present invention is a thermally conductive material containing composite particles that have: substantially spherical base particles; and flat adherend particles adhered to the surfaces of the base particles via a resin layer. The composite particles may further have, on the surface side thereof, crosslinked particles having a larger particle size than the adherend particles. This thermally conductive material may be a filler containing composite particles or a composite material containing said filler in a matrix. The composite particles are obtained, for example, by pressurizing a mixture in which substantially spherical first particles, flat second particles, and a resin are mixed, and by pulverizing the molded body. In addition, the composite particles may be produced by mixing substantially spherical first particles, flat second particles, third particles having a larger particle size than the second particles, and a resin in multiple stages.

JP2002295626	RESINOUS NUT
JP5285557	Aromatic polyimide film and its manufacturing method
JPH01259074	POWDER COATING COMPOSITION

HWANG JUNGHWAN (JP)
OHIRA YOSHIE (JP)

PCT/JP2023/015861

May 10, 2024

April 21, 2023

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TOYOTA CHUO KENKYUSHO KK (JP)

C08K7/18; C08L101/00; C09K5/14

WO2019189182A1	2019-10-03
WO2019194131A1	2019-10-10
WO2013042611A1	2013-03-28

JP2010235842A	2010-10-21
JP2015003980A	2015-01-08
JP2013079371A	2013-05-02
JP2014152299A	2014-08-25

MORIOKA Masayuki et al. (JP)

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