Title:
THERMALLY-CONDUCTIVE ADDITION TYPE ORGANOSILICON COMPOSITION FOR POTTING
Document Type and Number:
WIPO Patent Application WO/2024/088062
Kind Code:
A1
Abstract:
The present application relates to a thermally-conductive addition type organosilicon composition for potting, a method for preparing the organosilicon composition, and a product prepared from the organosilicon composition. The organosilicon composition comprises: A) at least one polysiloxane containing, per molecule, at least two vinyl groups bonded to a silicon atom; B) at least one hydrogen-containing polysiloxane having, per molecule, at least one hydrogen atom bonded to the same or different silicon atoms, provided that the component has a total of at least two hydrogen atoms bonded to the same or different silicon atoms; C) at least one platinum group metal catalyst; and D) a thermally-conductive filler, particles of the thermally-conductive filler being treated by using a vinyltrialkoxysilane oligomer or hydrolysate and having a D50 particle size ranging from 0.5 to 50 microns.
Inventors:
LEI LIJUAN (CN)
GUO PENG (CN)
SHEN JING (CN)
GUO PENG (CN)
SHEN JING (CN)
Application Number:
PCT/CN2023/123962
Publication Date:
May 02, 2024
Filing Date:
October 11, 2023
Export Citation:
Assignee:
JIANGXI BLUESTAR XINGHUO SILICONE CO LTD (CN)
International Classes:
C09J183/07; C09J11/04; C09J11/08
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Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (CN)
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