Title:
THERMAL-CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT OF SAME, AND THERMAL-CONDUCTIVE SHEET AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/053089
Kind Code:
A1
Abstract:
This thermal-conductive resin composition contains a polycarbonate polyol compound (A), a polyisocyanate compound (B), and a metal hydroxide filler (C1), and optionally contains a plasticizing agent (D). The hydroxyl group equivalent of the polycarbonate polyol compound (A) is 200-800 g/eq. The equivalent ratio (isocyanate group/hydroxyl group) of isocyanate groups in the polyisocyanate compound (B) with respect to hydroxyl groups in the polycarbonate polyol compound (A) is 0.27-0.39. If the thermal-conductive resin composition contains the plasticizing agent (D), the solubility parameter (SP value) of the plasticizing agent (D) is 9.0 (cal/cm3)1/2 or more. With respect to a total of 100 parts by mass of the polycarbonate polyol compound (A), the polyisocyanate compound (B), and the plasticizing agent (D), the contained amount of the metal hydroxide filler (C1) is 30-500 parts by mass, and the contained amount of the plasticizing agent (D) is 50 parts by mass or less.
More Like This:
| WO/2001/023458 | THERMOPLASTIC ELASTOMER, USE THEREOF, AND PROCESS FOR PRODUCING THE SAME |
| WO/2015/092005 | POLYMERIC COMPOSITION |
Inventors:
NAKATANI KOJI (JP)
Application Number:
PCT/JP2022/033894
Publication Date:
March 14, 2024
Filing Date:
September 09, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C08G18/08; C08G18/44; C08J5/18; C08K3/22; C08L75/04; C09K5/14
Domestic Patent References:
| WO2022201513A1 | 2022-09-29 | |||
| WO2021261519A1 | 2021-12-30 | |||
| WO2020240703A1 | 2020-12-03 |
Foreign References:
| JP2019172935A | 2019-10-10 | |||
| JPH111675A | 1999-01-06 | |||
| CN107880243A | 2018-04-06 | |||
| JP2017035802A | 2017-02-16 | |||
| CN112608709A | 2021-04-06 | |||
| CN112608708A | 2021-04-06 | |||
| CN112175566A | 2021-01-05 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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