Title:
TEMPERATURE SENSOR FOR BUSBAR, BUSBAR MODULE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/070405
Kind Code:
A1
Abstract:
Provided are a temperature sensor for a busbar that can measure the busbar temperature with high accuracy by reliably bringing a heat-receiving surface into close contact, a busbar module, and a manufacturing method therefor. The temperature sensor for a busbar according to the present invention is a temperature sensor 1 that is used by being attached to a busbar 2, the temperature sensor including a heat-sensitive element 3 and a case part 4 in which the heat-sensitive element is housed, wherein the busbar has a through hole 2a, the case part has a case body 5 and a protrusion 6 that is formed to protrude from the case body and can be inserted into the through hole, and the heat-sensitive element is housed in the protrusion.
Inventors:
EBISAWA SATOSHI (JP)
INUI SHINICHIROU (JP)
INUI SHINICHIROU (JP)
Application Number:
PCT/JP2023/031161
Publication Date:
April 04, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
G01K1/14; H01M50/50
Domestic Patent References:
| WO2021005999A1 | 2021-01-14 |
Foreign References:
| JP2016214011A | 2016-12-15 | |||
| JP2018059902A | 2018-04-12 | |||
| JP2018186643A | 2018-11-22 | |||
| JP2021158859A | 2021-10-07 | |||
| JP2023123262A | 2023-09-05 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi (JP)
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