Title:
TEMPERATURE SENSING MATERIAL, MOLDED BODY, AND PRODUCTION METHOD FOR TEMPERATURE SENSING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/171498
Kind Code:
A1
Abstract:
A temperature sensing material according to the present invention comprises 100 parts by mass of a thermoplastic resin (A) the density, MFR, and durometer A hardness of which are within specific ranges, 10-100 parts by mass of a compound (B) which has a flash point of not lower than 155°C, and 1.5-20 parts by mass of a porous inorganic compound (C) which has an oil absorption of not less than 4.0 g/g. When the content of the porous inorganic compound (C) is 100 parts by mass, the content of the compound (B) is greater than 200 parts by mass but less than 700 parts by mass. The temperature sensing material has specific optical properties.
Inventors:
YOSHII HIROAKI (JP)
Application Number:
PCT/JP2023/007600
Publication Date:
September 14, 2023
Filing Date:
March 01, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C09K9/02; C08K5/101; C08K7/24; C08L101/00
Domestic Patent References:
| WO2013061814A1 | 2013-05-02 | |||
| WO1993007004A1 | 1993-04-15 |
Foreign References:
| JP2016117863A | 2016-06-30 | |||
| JPH03222794A | 1991-10-01 | |||
| JPH03169590A | 1991-07-23 | |||
| JPH0524348A | 1993-02-02 | |||
| JP2018058050A | 2018-04-12 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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