TECHNICAL FIELD

The invention relates to a mechanism that can rotate the wafer blocks (sheets) over on their own axis and stacks them without damaging, regardless of the size, thickness and weight of the wafer blocks (sheets) in a separate conveyor band, with at most two stages and at most two motors, in order to solve all the technical problems experienced in the present technique.

PRIOR ART

Wafer sheets are produced by cooking the liquid wafer batter in an industrial wafer oven. Sizes and thicknesses of wafer sheets (for example, 350x500x3 mm) coming out of the oven vary depending on the customer request. The resulting product after wafer batter being cooked at high temperatures has a crunchy and brittle crispy structure. This means that the resulting products (wafer sheets) have low resistance and low bearing strength. Performing operations such as pushing, stopping or accelerating the masses of this structure, which has a low resistance and a light texture, is not easy. These structures are easily broken and scrapped in all operations performed without taking into account the fragility of the wafer sheet. Liquid masses such as filling material (cream, chocolate, etc.) are filled on the wafer sheets on the advancing lines. Immediately after the liquid masses are applied to the wafer sheets, structures called wafer blocks or wafer plates are formed as a result of stacking other cover wafer sheets on them. The wafer block or wafer sheets must enter the cutting machine in order to take the known wafer shape. The wafer block cutting machine cuts the blocks in two stages. The first cut and the second cut are performed with cutting cartridges (cutters). Cutting cartridges (cutters) are thin wire or thin sheet metal assembled side by side at certain intervals. In the wafer cutting machine, when the long or short sides of the products (wafer blocks) need to be rotated before entering the first cut, they must be rotated inside or outside the cutting machine. The reason for bringing the long or short side of the wafer block to a position perpendicular or parallel to the travelling direction of the conveyor band is the aim to cut the block with the least scrap and the packaging style of the product. The block cutting directions are determined by calculating the position of the product with the least scrap according to the product dimensions requested by the customers. It is very important that the long side of the wafer block enters the cutting machine parallel or perpendicular to the direction of travel of the conveyor band.

In the prior art, wafer blocks can only be rotated in three different ways. Wafer blocks coming out of the block cooling machine are run into a cylindrical obstacle (hard plastic, etc.) in the wide section of the outlet conveyor band. In the first rotation process, the block rotates around own axis and changes its position perpendicularly or parallel to the direction of travel of the conveyor band, as a result of a corner of the block hitting the obstacle. This method is very primitive and damages the edges of the wafer block. In the second rotation method, the wafer blocks can only be rotated in a separate station before entering the cutting machine. In this method, there are cylindrical shaped plastic rolls embedded in the open parts of the o-ring conveyor bands known as the segmented conveyor band system. As soon as the wafer block reaches the position of the rolls, the cylindrical rolls lift up from the o-ring conveyor band at the same time and lift the block by slightly exceeding the level of the o-ring conveyor band. It changes the direction of both the travel axis and the long or short side of the block by directing the block it lifts to the other conveyor band, which is perpendicular to the axis of travel of the o-ring conveyor band. The rotation takes place outside of the wafer block cutting machine in both methods described above. In the third rotation method, it is divided into two parts. The wafer blocks entering the wafer cutting machine are released on the ninety-degree conveyor band located in one-down position, and both the axis and the short or long side of the wafer are changed by changing the direction of entry into the first cut. The second part, which is the current technique, is the same release technique designed in three stages. The blocks are released in the wafer block stacking space at the first stage. The stacking space holds the wafer block lightly from its edges in a manner to be empty in the middle. The stacking space releases the block in the rotating space, which is the second tier, by opening the edge flaps when it turn comes. The rotating space in the second tier rotates the direction of the block above it around its own axis. After the rotation is completed, the rotation space opens its vanes and releases the block on to the conveyor band where the cutting pusher is located, which is the third stage. With the block released in the last section, which is the third tier, the pusher pushes the block towards the cutting cartridge at a certain speed, and thus the cutting process starts. ln the prior art, when it is desired to rotate the wafer block without damaging it, a separate conveyor band or a separate station is required for rotation. In the first part of the third method, when the axis of the short/long sides of the wafer blocks desired to be changed, it has to be released from a high conveyor band down onto a lower conveyor band. This damages the edges of the wafer block. The second part of the third method, that is, in the current technique, the wafer block is released from small heights in three stages, and the axis can only be changed by rotating it in the middle section. In the last method, a separate motor must be used for each stage. Performing the operations in three stages increases both the number of motors, stacking time and cutting time.

LIST IF DRAWINGS

Figure 1. General View of the Invention and Its Components Figure 2. Detail View of the Invention and the Components of the Rotation Mechanism that Provides the Drive and Rotational Motion

Figure 3. View of the Invention, Jack Jaw Opening/Closing Mechanism and Sub- Components and Open Position of the Mechanism

Figure 4. Detail View of the Invention, Jack Jaw Opening/Closing Mechanism and Sub-Components Figure 5. View of the Invention, Jack Jaw Opening/Closing Mechanism and Sub-

Components and Close Position of the Mechanism Figure 6. General View of the Invention and Its Components Figure 7. General View of the Invention and Its Components Figure 8. General View of the Drive and Rotation Mechanism of the Invention Figure 9. View of the Position of the Wafer Block in the Rotation Mechanism and the Image of the Conveyor band in Down Position Before the Mechanism starts Rotating

Figure 10. Image of the Rotational Motion of the Invention Around Its Own Axis Figure 11. (Patent 17) The View of the Position where the I nvention Completes the Rotational Motion Around Its Own Axis

Figure 12. (Patent 19) A View of the Invention releasing the Wafer Block in the Stacking Space

Figure 12. (Patent 20) Image of Invention Correcting the Position and Edges of the Incoming Product with the Edge Trimmer Sheets Figure 13. (Patent 21) View of Invention Returning to Its Previous Position After Releasing the Wafer Block

Figure 14. (Patent 23) View of the Invention While Taking the Second Wafer Block to the Rotation Mechanism Figure 15. (Patent 26) View of the Position where the Invention Completes the

Rotational Movement Around Its Axis with the Second Wafer Block

Figure 15. (Patent 27) View of Invention Opening and Placing the Second Wafer Block in the Stacking Space

The names of the part numbers indicated in the figures are as follows; 1. Wafer Block Rotation and Stacking Mechanism

1.1. Servo Motor and Reducer

1.2. Pinion Gear

1.3. Main Gear

1.4. Detailed Hub Shaft

1.5. Rotary Limit Sensor

1.6. Pneumatic Pen Cylinder

1.7. Jack Jaw Opening/Closing Mechanism

1.7.1. Main Thrust/Transmission Piece

1.7.2. Force Transmission Arm

1.7.3. Force Compression Arm

1.7.4. Intermediate Force Transfer Arm

1.7.5. Mechanism Force Transmission Arm

1.8. Linear Carrier Slide

1.9. Movable Jaw

1.10. Stop Lugs

1.11. Alignment Flaps

1.12. Roller Bearing Pneumatic Cylinder

1.13. Edge Trimmer Sheet

1.14. Product Release/Rotation /Alignment Sensor

1.15. Short Stroke Pneumatic Cylinder

1.16. Block Inlet Conveyor band

1.17. Stacking Space DETAILED DESCRIPTION OF THE INVENTION

Invention consists of parts and sections of servo motor and reducer (1.1), pinion gear (1.2), main gear (1.3), detailed hub shaft (1.4), rotary limit sensor (1.5), pneumatic pen cylinder(1.6), jack jaw opening/closing mechanism (1.7), main thrust/transmission piece (1.7.1), force transmission arm (1.7.2), force compression arm (1.7.3), intermediate force transmission arm (1.7.4), mechanism force transmission arm (1.7.5) ), linear carrier slide (1.8), movable jaw (1.9), stop lugs (1.10), alignment flaps (1.11), roller bearing pneumatic system (1.12), edge-trimmer sheet (1.13), product release/rotation/alignment sensor (1.14), short stroke pneumatic cylinder(1.15), block inlet conveyor band (1.16), stacking space (1.17).

In the prior art, wafer blocks can only be rotated before or after entering the cutting machine by knocking the corner so that the long/short side can be rotated, or rotated with a separate conveyor band, rotated by releasing from a certain height or by releasing it from a small height in three-steps. It can be described as the result that the wafer blocks can only be rotated by damaging the block (knocking or dropping) or with a separate conveyor band or by using many motors (at least three motors) in three stages. The invention consists of maximum of two stages, a maximum of two motors, a rotating mechanism and a pneumatic pen cylinder(1.6) within the rotating mechanism, which can rotate wafer blocks around their own axis without damaging the blocks and stack them, regardless of the size, thickness and weight of the wafer blocks (sheets). The invention can stack the wafer block by rotating it around its own axis without damaging the block, without knocking or dropping it in the cutting machine. It processes the incoming product in a serial manner without waiting and can fill the products into the stacking space. It can rotate the wafer blocks easily and rapidly around their own axis without any need for product-damaging methods (knocking/dropping), another station, a multi-stage design, excess material and many motors. It eliminates problems such as wafer block breakage, damage and long rotation time until it reaches the cutting cartridge.

The mechanism is located on metal legs that are in a spider-feet-like position. The mechanism is in line with the wafer cutting inlet conveyor band (1.16) and is positioned just after the conveyor band. Wafer blocks incoming from the inlet conveyor band (1.16) enter between the alignment flaps (1.11) and the movable jaws (1.9) in full alignment. Movable jaws (1.9) have slightly more gap (at least 3 m ) than the block dimensions for the blocks to enter easily. The stop lugs (1.10) prevent the conveyor band from shifting the product too much and prevent the fast-incoming product from exiting from the other side. Movable jaws (1.9) hold the product from the edges of the long sides in a way that the middle remains clear. After the wafer block is placed on the movable jaws (1.9), the product release/rotation/alignment sensor (1.14) immediately detects the product and sends a rotate command to the servo motor (1.1). Just before the mechanism starts its rotational movement, the block inlet conveyor band (1.16) makes a downward movement by means of the short stroke pneumatic cylinder(1.15) located under the end of the conveyor band so that it does not hit the adjacent block inlet conveyor band (1.16). Subsequently, the servo motor (1.1) rotates the pinion gear (1.2) and the pinion gear (1.2) rotates the main gear (1.3). The reason why the long or short side of the wafer block is wished to be brought to a position perpendicular or parallel to the direction of movement of the conveyor band is the desire to cut the wafer block with the least waste and the packaging style of the product. The rotation angle is determined according to the final wafer shape to be produced by the wafer manufacturer in order to cut the long or short sides of the wafer blocks. The rotary limit sensor (1.5) limits the rotation of the block to be cut according to the determined angle. As soon as the wafer block completes its rotational movement, the product release/rotation sensor (1.14) commands the pneumatic pen cylinder(1.6) to open the movable jaws (1.9). The pneumatic pen cylinder(1.6) pushes forward the jack jaw opening/closing mechanism (1.7) to which it is connected. With the starting torque it receives from the pneumatic pen cylinder(1.6), the main thrust/transmission piece (1.7.1) transmits the planar incoming force to the force transmission arms (1.7.2), and at the same time compresses the incoming force on the detailed hub shaft (1.4). The force compressed in the detailed hub shaft (1.4) is transmitted to the arms at an optimum level. Thus, the loss of force is minimized. The force transmission arms (1.7.2) first compress the force it receives between the force compression arms (1.7.3) and the main thrust/ transmission pieces (1.7.1). With the compression of the force transmission arms (1.7.2) and force compression arms (1.7.3), the joints to which they are connected change their movement and the received force is transmitted to the intermediate force transfer arm (1.7.4). The intermediate force transmission arms (1.7.4) transmit the force it receives to the mechanism force transmission arms (1.7.5). Mechanism force transmission arms (1.7.5) transfer the force it receives to the linear carrier slides (1.8) to which it is connected. Linear carrier slides (1.8) transfer the movement received from the transmission mechanism to the movable jaws (1.9). Movable jaws (1.9) are opened sideways to the right and left with the movement they receive. Thus, the motion taken from a single pneumatic pen cylinder(1.6) is transferred in a manner to be divided into motions in two opposite directions. When the movable jaws (1.9) open, the wafer block is released and placed in the stacking space (1.17). The movable jaws (1.9) come to the closed position, and in the meantime, the block inlet conveyor band (1.16), which is in the lower position, is lifted and aligned with the mechanism. After the block inlet conveyor band (1.16) rises to the up position, the product release/rotation sensor (1.14) gives rotate command to the servo motor (1.1). The servo motor (1.1) rotates the pinion gear (1.2) and the pinion gear (1.2) rotates the main gear (1.3). Thus, the movable jaws (1.9) rotate the whole mechanism to receive new products. While these processes continue, the processes in the stacking space (1.17) begin. The product release/rotation sensor (1.14) sends a movement command to the roller bearing pneumatic cylinders (1.12) so that when each block is released, the edges of each block placed are conjugated with the other blocks. Roller bearing pneumatic cylinders (1.12) that receive the command move towards the product/products together with the edge trimmer sheets (1.13) to which they are connected. Edge trimmer sheets (1.13) take the products between them and compress them very lightly. Thus, the product/products are stacked with matching edges. Wafer blocks are easily stacked with this method according to the desired number of stacks. This action is repeated for each product. The data from the rotary limit sensor (1.5) and the product release/rotation/alignment sensor (1.14) are transmitted to the processor and all commands such as rotation, release, shutdown, conveyor band lifting, stack trimming are transmitted to the required mechanism by the processor.