Title:
SUBSTRATE PROCESSING SYSTEM AND TRANSPORT METHOD
Document Type and Number:
WIPO Patent Application WO/2024/095856
Kind Code:
A1
Abstract:
This substrate processing system comprises: a processing module including a processing chamber, a substrate support unit, and a lifter; a vacuum transfer module that is connected to the processing module and includes a transport robot for transporting a ring; and a control unit. The control unit performs: (A) a step for lifting the plurality of support pins to separate the ring from a support surface of the substrate support unit; (B) a step for, after the step (A), acquiring an indicator related to a positional offset amount of the ring; and (C) a step for determining whether the position of the ring should be corrected, on the basis of the indicator related to the positional offset amount acquired in the step (B).
Inventors:
AKAMA TOSHIKI (JP)
KATO SHUSEI (JP)
PARK GYEONG MIN (JP)
SASAKI NOBUTAKA (JP)
KATO SHUSEI (JP)
PARK GYEONG MIN (JP)
SASAKI NOBUTAKA (JP)
Application Number:
PCT/JP2023/038477
Publication Date:
May 10, 2024
Filing Date:
October 25, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/68; H01L21/3065; H01L21/677
Attorney, Agent or Firm:
ITOH, Tadashige et al. (Marunouchi MY PLAZA 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, JP)
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