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Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/095780
Kind Code:
A1
Abstract:
A substrate processing system (S) according to one aspect of the present disclosure comprises a processing fluid supply device (70), a substrate processing device (1), a supply line, and a temperature measurement unit. The processing fluid supply device (70) supplies a processing fluid that has been adjusted to a given temperature. The substrate processing device (1) processes a substrate using the processing fluid supplied from the processing fluid supply device (70). The supply line is connected between the processing fluid supply device (70) and the substrate processing device (1). The temperature measurement unit measures, in the supply line, at least one among the temperature of the processing fluid and the temperature of the supply line.

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Inventors:
NAKASHIMA MIKIO (JP)
UMEZAKI SHOTA (JP)
HAYASHIDA TAKAHIRO (JP)
Application Number:
PCT/JP2023/037811
Publication Date:
May 10, 2024
Filing Date:
October 19, 2023
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
US20190291144A12019-09-26
JP2011035133A2011-02-17
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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