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Patent Searching and Data


Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/246394
Kind Code:
A1
Abstract:
A substrate processing apparatus, comprising a process chamber (1000), a substrate tray (400), a megasonic emission device (30) and a cleaning device (10). The substrate tray (400) is arranged inside the process chamber (1000), the substrate tray (400) being used for bearing a substrate (500). The megasonic emission device (30) is used for transmitting megasonic energy to a chemical liquid between the megasonic emission device (30) and the substrate (500). The cleaning device (10) is used for cleaning the megasonic emission device (30). The cleaning device (10) comprises an electrostatic guiding assembly (200), the electrostatic guiding assembly (200) being arranged on the cleaning device (10), and the electrostatic guiding assembly (200) being electrically connected to the megasonic emission device (30) so as to guide the charges away from the megasonic emission device (30), thereby preventing damaging defects on the surface of the substrate (500) caused by discharging of the charges accumulated on the megasonic emission device (30).

Inventors:
WANG HUI (CN)
LIU YANG (CN)
HE XIDENG (CN)
HU HAIBO (CN)
ZHANG XIAOYAN (CN)
CHEN FUPING (CN)
Application Number:
PCT/CN2023/095239
Publication Date:
December 28, 2023
Filing Date:
May 19, 2023
Export Citation:
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Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
B08B3/12; H01L21/67
Domestic Patent References:
WO2008085258A12008-07-17
Foreign References:
CN103489814A2014-01-01
CN110838457A2020-02-25
CN112207085A2021-01-12
CN105983552A2016-10-05
CN109890520A2019-06-14
CN114345826A2022-04-15
JP2019145734A2019-08-29
US20050082000A12005-04-21
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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