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Patent Searching and Data


Title:
SUBMODULE FOR SINGLE PACKAGING TYPE SEMICONDUCTOR TRANSFORMER WITH REDUCED PARTIAL DISCHARGE AND EXCELLENT INSULATION PERFORMANCE
Document Type and Number:
WIPO Patent Application WO/2023/200063
Kind Code:
A1
Abstract:
The present invention relates to a submodule for a single packaging type semiconductor transformer with reduced partial discharge and excellent insulation performance, wherein the submodule may secure a separation distance between a high-voltage unit and a low-voltage unit in the semiconductor transformer to increase insulation performance, and may further improve the insulation performance by reducing the amount of partial discharge in the semiconductor transformer by having an equipotential structure applied to each stage of the semiconductor transformer submodule. The submodule for a single packaging type semiconductor transformer with reduced partial discharge and excellent insulation performance of the present invention comprises: a high-voltage unit that converts high-voltage, low-frequency AC power into high-frequency AC power; a transformation unit that converts high-voltage AC power into low-voltage AC power; and a low-voltage unit that converts low-voltage AC power into low-voltage DC power.

Inventors:
KIM SUNG JOO (KR)
JEONG BYUNG HWAN (KR)
Application Number:
PCT/KR2022/018529
Publication Date:
October 19, 2023
Filing Date:
November 22, 2022
Export Citation:
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Assignee:
HYOSUNG HEAVY IND CORP (KR)
International Classes:
H02M7/00; H01F27/02; H01F27/08; H01F30/06; H01F38/04; H02M3/00; H02M5/40
Foreign References:
US20110149606A12011-06-23
CN2256601Y1997-06-18
KR200452571Y12011-03-08
CN106129828B2018-07-06
KR101357445B12014-02-03
KR20200048376A2020-05-08
Attorney, Agent or Firm:
SU INTELLECTUAL PROPERTY (KR)
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