Title:
SPECIFICATION RESIN COMPOSITION AND FILM PREPARED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2024/082221
Kind Code:
A1
Abstract:
A resin composition comprises a polyamideimide resin and a fibrous alumina filler. The polyamideimide resin comprises one or more imide structural units and one or more amide structural units, wherein each imide structural unit is represented by formulas (I-1) to (I-3) and each amide structural unit represented by formula (I-4). The fibrous alumina filler is dispersed in the resin composition in a state that an average fiber diameter is 4 to 30 nm and an average fiber length is 20 to 4,000 nm. A film comprising the resin composition has excellent mechanical properties.
Inventors:
YANG HONGSHENG (JP)
FUKUTA SEIJIRO (JP)
HASHIMOTO KASUMI (JP)
WATANABE RAKU (JP)
MOTOMATSU JO (JP)
AKITA HIROYA (JP)
FUKUTA SEIJIRO (JP)
HASHIMOTO KASUMI (JP)
WATANABE RAKU (JP)
MOTOMATSU JO (JP)
AKITA HIROYA (JP)
Application Number:
PCT/CN2022/126479
Publication Date:
April 25, 2024
Filing Date:
October 20, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
TAIYO HOLDINGS CO LTD (JP)
TAIYO HOLDINGS CO LTD (JP)
International Classes:
C08L79/08; B32B27/34; C08K7/08
Foreign References:
| TW202206547A | 2022-02-16 | |||
| JP2022057332A | 2022-04-11 | |||
| JP2021169562A | 2021-10-28 | |||
| JP2017036415A | 2017-02-16 | |||
| JP2022059896A | 2022-04-14 |
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