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Patent Searching and Data


Title:
SOLE AND SHOE
Document Type and Number:
WIPO Patent Application WO/2023/058119
Kind Code:
A1
Abstract:
Provided is a sole that constitutes a part of a shoe. The sole includes: a cushioning part (210) that mitigates the impact applied to a foot when landing; and a support part (220) that has an elastic modulus that is higher than the elastic modulus of the cushioning part and that supports the foot. The support part (220) has a support surface (220a) provided around the cushioning part. The cushioning part (210) has a recessed surface (212) and a plurality of columnar bodies (214H, 214L). The cushioning part (210) includes: a high-elastic region (210H) adjacent to the support surface (220a); and a low-elastic region (210L) that is adjacent to the high-elastic region and that has an elastic modulus that is lower than the elastic modulus of the high-elastic region.

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Inventors:
TSUKADA HIROYUKI (JP)
MIYAKE HIROKI (JP)
Application Number:
PCT/JP2021/036848
Publication Date:
April 13, 2023
Filing Date:
October 05, 2021
Export Citation:
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Assignee:
ASICS CORP (JP)
International Classes:
A43B13/14; A43B13/18
Domestic Patent References:
WO2021210044A12021-10-21
Foreign References:
US20130104419A12013-05-02
JP2020163083A2020-10-08
JP3049755U1998-06-26
JP2019063491A2019-04-25
US20040159013A12004-08-19
GB510426A1939-08-01
JPH0448805U1992-04-24
US5084987A1992-02-04
JP2019165937A2019-10-03
US20150223560A12015-08-13
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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