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Title:
SOLDER ALLOY, SOLDER BALL, SOLDER PREFORM, SOLDER PASTE, AND SOLDER JOINT
Document Type and Number:
WIPO Patent Application WO/2023/054629
Kind Code:
A1
Abstract:
Provided are: a solder alloy having excellent wettability and high reliability by suppressing breakage of a solder joint; and a solder joint. The solder alloy has an alloy composition comprising, by mass%, 1.0-3.7% of Ag, 0.4-0.8% of Cu, 0.50-2.90% of Sb, 5.00-10.00% of In, and 0.01-0.06% of Ni, with the balance being Sn.

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Inventors:
YOKOYAMA TAKAHIRO (JP)
SAITO TAKASHI (JP)
YOSHIKAWA SHUNSAKU (JP)
SUGISAWA KOTA (JP)
Application Number:
PCT/JP2022/036552
Publication Date:
April 06, 2023
Filing Date:
September 29, 2022
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; B23K35/22; C22C13/00
Domestic Patent References:
WO2015198496A12015-12-30
WO2021043437A12021-03-11
Foreign References:
CN108994480A2018-12-14
JP2018122324A2018-08-09
CN103341699A2013-10-09
JP2015020182A2015-02-02
JP2019063830A2019-04-25
JPH037005A1991-01-14
Attorney, Agent or Firm:
KENMOTSU Hidetaka (JP)
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