Title:
SLICING METHOD FOR LARGE SIZE ULTRA-THIN LITHIUM NIOBATE WAFER
Document Type and Number:
WIPO Patent Application WO/2023/019738
Kind Code:
A1
Abstract:
Disclosed in the present invention is a slicing method for a large size ultra-thin lithium niobate wafer, comprising: chemically etching a lithium niobate ingot using a mixed solution of nitric acid and hydrofluoric acid; performing an ingot bonding operation on the etched ingot, bonding resin sheets on a head and a tail of the ingot, and bonding resin strips on an upper end and two sides of the ingot; cutting the bonded ingot into a wafer, a cutting fluid used being a mixed solution consisting of naphthenic oil, paraffin oil, polyethylene glycol monooleate, bentonite, and barium sulfonate salt of specified mass fractions; debonding the wafer; chemically etching the debonded wafer, finally obtaining a large size ultra-thin lithium niobate wafer having high surface flatness, small deviation of crystal orientation, small depth of line marks, and a low processing fragmentation rate.
Inventors:
SHEN HAO (CN)
XU QIUFENG (CN)
ZHU HAIYING (CN)
XU QIUFENG (CN)
ZHU HAIYING (CN)
Application Number:
PCT/CN2021/127838
Publication Date:
February 23, 2023
Filing Date:
November 01, 2021
Export Citation:
Assignee:
TDG HOLDING CO LTD (CN)
International Classes:
B28D5/04
Foreign References:
| CN113386275A | 2021-09-14 | |||
| CN110789012A | 2020-02-14 | |||
| CN112092225A | 2020-12-18 | |||
| CN102839419A | 2012-12-26 | |||
| CN111230598A | 2020-06-05 | |||
| CN204136255U | 2015-02-04 | |||
| CN202174659U | 2012-03-28 | |||
| CN102380914A | 2012-03-21 | |||
| DE10014445A1 | 2001-10-11 |
Attorney, Agent or Firm:
CHANGZHOU BAIYETENGFEI PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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