Title:
SLICING DEVICE, AND METHOD FOR SLICING WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2023/219092
Kind Code:
A1
Abstract:
This slicing device comprises a cutter device (12), a workpiece retaining part, a relative movement device, and a slicing position manipulating unit. The cutter device (12) has a slicing blade that is driven in a direction along a blade surface. The workpiece retaining part retains a workpiece. The relative movement device moves the workpiece retaining part and the cutter device (12) relative to one another in a slicing direction in which a workpiece, i.e., m meat, is sliced. The slicing position manipulating unit causes the slicing blade of the cutter device (12) to approach or separate from the workpiece moving relative thereto in the slicing direction, in a direction intersecting the slicing direction. At a position on the slicing blade abutting the workpiece, a blade surface section for cutting the workpiece along the driving direction of the slicing blade and a pressing section for pressing the outer surface of the workpiece are arranged alternatingly.
Inventors:
KODAMA RYUJI (JP)
USUI HIROYUKI (JP)
UMEDA SEIICHIRO (JP)
GOTO OSAMU (JP)
HANE SHINJI (JP)
USUI HIROYUKI (JP)
UMEDA SEIICHIRO (JP)
GOTO OSAMU (JP)
HANE SHINJI (JP)
Application Number:
PCT/JP2023/017504
Publication Date:
November 16, 2023
Filing Date:
May 10, 2023
Export Citation:
Assignee:
MAEKAWA SEISAKUSHO KK (JP)
International Classes:
A22C17/00; A22C21/00
Domestic Patent References:
| WO2009139032A1 | 2009-11-19 |
Foreign References:
| JPH02177849A | 1990-07-10 | |||
| JP2019509743A | 2019-04-11 | |||
| US5277649A | 1994-01-11 | |||
| JP2005144598A | 2005-06-09 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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