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Title:
SILICON ROD CUTTING APPARATUS AND CUTTING CONTROL METHOD
Document Type and Number:
WIPO Patent Application WO/2024/002159
Kind Code:
A1
Abstract:
A silicon rod cutting apparatus and a cutting control method. The silicon rod cutting apparatus comprises: a base (1); a silicon rod bearing device (2) provided on the base (1); a wire-based cutting device (3) provided on the base (1), wherein the wire-based cutting device (3) and the silicon rod bearing device (2) can move relative to each other, and in the relative movement process, a cutting wire (6) wound on the wire-based cutting device (3) cuts a silicon rod (7); and a centering device (5) provided on the silicon rod bearing device (2), wherein at least one pair of centering jaws (535) in the centering device (5) extend to two sides of the silicon rod (7) and are used for pushing the silicon rod (7) to move to a target cutting position corresponding to the cutting wire (6). The silicon rod cutting apparatus and the cutting control method can realize the centering of the silicon rod, so as to cut, by means of the cutting wire, the silicon rod into small silicon rods having a smaller cross-sectional area.

Inventors:
CHEN MINGYI (CN)
XUE JUNBING (CN)
SU GENG (CN)
MA FEI (CN)
Application Number:
PCT/CN2023/103184
Publication Date:
January 04, 2024
Filing Date:
June 28, 2023
Export Citation:
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Assignee:
QINGDAO GAOCE TECH CO LTD (CN)
International Classes:
B28D5/04
Domestic Patent References:
WO2021013238A12021-01-28
Foreign References:
CN115070971A2022-09-20
CN115056372A2022-09-16
CN217621498U2022-10-21
CN216506049U2022-05-13
CN207267302U2018-04-24
GB1071492A1967-06-07
GB1348368A1974-03-13
GB745278A1956-02-22
CN114454366A2022-05-10
Attorney, Agent or Firm:
IPFUTURE INTELLECTUAL PROPERTY OFFICE (CN)
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