Title:
SENSOR PACKAGING STRUCTURE, AND DIFFERENTIAL PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/111132
Kind Code:
A1
Abstract:
A sensor packaging structure (100) and a differential pressure sensor. The sensor packaging structure (100) comprises: a housing (10); a base plate (20), the housing (10) being arranged on the base plate (20) and enclosing an accommodating space (50) with the base plate (20), with a first vent hole (11) of the housing (10) and a second vent hole (21) of the base plate (20) both being in communication with the accommodating space (50); a sensor chip (30) and a signal processing chip (40) which are accommodated in the accommodating space (50) and electrically connected to and stacked on the base plate (20), the sensor chip (30) being located on a side of the signal processing chip (40) that is away from the base plate (20), the sensor chip (30) having a vibration cavity (31), the signal processing chip (40) being provided with a third vent hole (41), and the vibration cavity (31) being in communication with the second vent hole (21) by means of the third vent hole (41); and waterproof glue (60) filling the accommodating space (50) and covering the sensor chip (30) and the signal processing chip (40).
Inventors:
YAN WENMING (CN)
Application Number:
PCT/CN2021/124544
Publication Date:
June 02, 2022
Filing Date:
October 19, 2021
Export Citation:
Assignee:
WEIFANGGOERTEK MICROELECTRONICS CO LTD (CN)
International Classes:
G01L19/04; G01L13/02; G01L19/14; H01L23/31; H01L25/16
Foreign References:
| CN213688772U | 2021-07-13 | |||
| CN209400128U | 2019-09-17 | |||
| CN205754730U | 2016-11-30 | |||
| CN210953183U | 2020-07-07 | |||
| CN208847393U | 2019-05-10 | |||
| CN208704948U | 2019-04-05 | |||
| CN111362227A | 2020-07-03 | |||
| JPH07311111A | 1995-11-28 |
Attorney, Agent or Firm:
CENFO INTELLECTUAL PROPERTY AGENCY (CN)
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