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Title:
SENSOR MODULE
Document Type and Number:
WIPO Patent Application WO/2024/043050
Kind Code:
A1
Abstract:
This sensor module comprises: a first member; a second member having a Young's modulus lower than that of the first member; and a sensor that is for detecting deformation of the second member and that is in contact with the second member. The distance between the first member and the sensor is longer than the distance between the first member and the second member.

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Inventors:
MORITA MASANORI (JP)
OE KANA (JP)
Application Number:
PCT/JP2023/028701
Publication Date:
February 29, 2024
Filing Date:
August 07, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01L1/16
Foreign References:
US4854174A1989-08-08
JP2013148575A2013-08-01
JP2009198221A2009-09-03
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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