Title:
SENSOR MODULE AND VEHICLE
Document Type and Number:
WIPO Patent Application WO/2022/224985
Kind Code:
A1
Abstract:
A sensor module is provided with: a sensor; a semiconductor device including a drive unit configured to drive the sensor and a processing unit configured to process an output signal from the sensor; a switching unit configured to switch between cutting off/disabling, and not cutting off/disabling, supply of the output signal from the sensor to the processing unit; a storage unit configured to store temperature correction details in a non-volatile manner; and a control unit configured to perform temperature correction for the drive unit and the processing unit on the basis of the temperature correction details.
Inventors:
KANEDA YUJI (JP)
Application Number:
PCT/JP2022/018263
Publication Date:
October 27, 2022
Filing Date:
April 20, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
G01D3/028
Foreign References:
| JP2004108825A | 2004-04-08 | |||
| JP2015204608A | 2015-11-16 | |||
| JP2010156686A | 2010-07-15 |
Attorney, Agent or Firm:
SANO PATENT OFFICE (JP)
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