Title:
SEMICONDUCTOR WAFER TRANSPORT CONTAINER AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/095441
Kind Code:
A1
Abstract:
A semiconductor wafer transport container according to one embodiment comprises a plastic container for accommodating a semiconductor wafer. The vicinity of the surface of the plastic at least at an inner surface of the plastic container is impregnated with an aluminum oxide having a hydroxyl group. A structure in which 1 at% or more of the aluminum oxide is dispersed in the plastic, in terms of the concentration of elemental aluminum, is present at least at a depth within a range of 50 nm to 10 μm inclusive from the inner surface.
Inventors:
ASAKAWA KOJI (JP)
Application Number:
PCT/JP2022/041135
Publication Date:
May 10, 2024
Filing Date:
November 04, 2022
Export Citation:
Assignee:
KIOXIA CORP (JP)
International Classes:
H01L21/673
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (5-1 Kanda-Sarugakucho 1-chome, Chiyoda-k, Tokyo 64, JP)
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