Title:
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/151711
Kind Code:
A1
Abstract:
Provided are a semiconductor structure and a manufacturing method therefor. The semiconductor structure comprises a substrate, the substrate being provided with a first face and a second face which are opposite each other; a magnetic core, the magnetic core being located in the substrate, and an orthographic projection of the magnetic core on the first face being a closed annular pattern; a dielectric layer, the dielectric layer being located on the second face; and a solenoid-shaped metal layer, the metal layer being located in the substrate and the dielectric layer, being wound around the periphery of the magnetic core, and having an integrated structure, a gap being provided between the metal layer and the magnetic core, part of the metal layer being exposed out of the first face, and part of the metal layer being exposed out of the surface of the dielectric layer away from the substrate.
Inventors:
WU TONG (CN)
Application Number:
PCT/CN2021/109964
Publication Date:
July 21, 2022
Filing Date:
August 02, 2021
Export Citation:
Assignee:
CHANGXIN MEMORY TECH INC (CN)
International Classes:
H01L23/64; H01L49/02
Foreign References:
| CN112864135A | 2021-05-28 | |||
| CN102479685A | 2012-05-30 | |||
| US20190272936A1 | 2019-09-05 | |||
| CN108807300A | 2018-11-13 | |||
| US20020066175A1 | 2002-06-06 |
Attorney, Agent or Firm:
BOXIN CHINA INTELLECTUAL PROPERTY (CN)
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