Title:
SEMICONDUCTOR PROCESS APPARATUS AND CALIBRATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/227099
Kind Code:
A1
Abstract:
A semiconductor process apparatus and a calibration device. In the calibration device, a mounting platform (1) is used for mounting a driving mechanism (2) and a calibration mechanism (3), wherein the driving mechanism (2) comprises a cam (21) and a driver (22); the cam (21) is located at the top of the mounting platform (1); the cam (21) is provided with a plurality of bulges (211) and a plurality of recesses (212) which are alternately arranged in a circumferential direction of the cam; the driver (22) is used for driving the cam (21) to rotate; the calibration mechanism (3) comprises a plurality of movable bearing assemblies (31), which are distributed at intervals in the circumferential direction of the cam (21) and are used for jointly bearing a wafer cutting workpiece (100); and the plurality of movable bearing assemblies (31) can move in the radial direction of the cam (21), correspondingly match the plurality of bulges (211) or the plurality of recesses (212) on the cam (21) on a one-to-one basis, and are used for selectively synchronously moving away from or approaching the cam (21) when the cam (21) rotates, so as to calibrate the position of the wafer cutting workpiece (100). The semiconductor process apparatus comprises a transfer chamber, a process chamber, a manipulator and the calibration device. The semiconductor process apparatus and the calibration device calibrate the position of the wafer cutting workpiece (100), and avoid the deviation of the wafer cutting workpiece (100) from an electrostatic chuck position during a transfer process, thereby greatly increasing the product yield.
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Inventors:
YUAN ZHITAO (CN)
TANG XIWEN (CN)
TANG XIWEN (CN)
Application Number:
PCT/CN2023/096490
Publication Date:
November 30, 2023
Filing Date:
May 26, 2023
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
B28D7/00; H01L21/67
Foreign References:
| CN114953231A | 2022-08-30 | |||
| CN215200206U | 2021-12-17 | |||
| CN114420618A | 2022-04-29 | |||
| CN106182474A | 2016-12-07 | |||
| CN112201607A | 2021-01-08 | |||
| JP2020171976A | 2020-10-22 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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