Title:
SEMICONDUCTOR PACKAGED STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/092612
Kind Code:
A1
Abstract:
A semiconductor package device includes a die carrier, a first die, a second die, a third die, a first conductive pillar, and a second conductive pillar. The die carrier defines a cavity. The first die is disposed in the cavity. The second die is disposed in the cavity and over the first die. The first die comprises a first pad and a bonding wire. The second die comprises a second pad electrically connected with the first pad via the bonding wire. The third die is disposed in the cavity and over the second die and comprises a third pad. The first conductive pillar is disposed on the second pad. The second conductive pillar is disposed on the third pad.
Inventors:
XU ERGANG (CN)
CAO KAI (CN)
ZHANG LEI (CN)
CAO KAI (CN)
ZHANG LEI (CN)
Application Number:
PCT/CN2022/129528
Publication Date:
May 10, 2024
Filing Date:
November 03, 2022
Export Citation:
Assignee:
INNOSCIENCE SUZHOU SEMICONDUCTOR CO LTD (CN)
International Classes:
H01L23/498; H01L23/538
Foreign References:
| CN111066144A | 2020-04-24 | |||
| CN112908979A | 2021-06-04 | |||
| US20100193930A1 | 2010-08-05 | |||
| US20110062596A1 | 2011-03-17 | |||
| CN103641060A | 2014-03-19 |
Attorney, Agent or Firm:
BEIJING BESTIPR INTELLECTUAL PROPERTY LAW CORPORATION (CN)
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