Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2024/095710
Kind Code:
A1
Abstract:
The present invention improves adhesion between joined parts of a metal wiring board and a sealing resin in a semiconductor module. A semiconductor module (1) comprises: a multi-layer substrate (2) having a plurality of circuit boards (22) disposed on the upper surface of an insulating plate (20); a semiconductor element (3) disposed on the upper surface of at least one of the circuit boards; and a metal wiring board (4) disposed on the upper surface of the semiconductor element. The metal wiring board has a first joined part (40) joined to the upper surface of the semiconductor element via a first joining member (S3). The first joined part includes a plate-like portion having an upper surface and a lower surface, and has, on the upper surface of the plate-like portion, at least one groove (50, 53) provided along the outer periphery of the first joined part.
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Inventors:
SAITO MAI (JP)
NAKAMURA YOKO (JP)
WATAKABE TSUBASA (JP)
IWAYA AKIHIKO (JP)
NAKAMURA YOKO (JP)
WATAKABE TSUBASA (JP)
IWAYA AKIHIKO (JP)
Application Number:
PCT/JP2023/036705
Publication Date:
May 10, 2024
Filing Date:
October 10, 2023
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L25/07; H01L25/18
Attorney, Agent or Firm:
INFORT PATENT FIRM (3-12 Kioicho Chiyoda-k, Tokyo 94, JP)
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