Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2024/095597
Kind Code:
A1
Abstract:
This semiconductor module comprises at least one substrate and a plurality of semiconductor switching elements. The substrate has a first electrode pattern, a second electrode pattern, and a third electrode pattern, the first electrode pattern being positioned between the second electrode pattern and the third electrode pattern in plan view. The semiconductor switching elements each have a first surface joined to the first electrode pattern, and a second surface facing in the opposite direction to the first surface. A control electrode, a control wiring connected to the control electrode, and a main electrode having a plurality of regions separated by the control wiring are provided to the second surface. Each of the plurality of regions is electrically connected to the second electrode pattern via a first wire and is electrically connected to the third electrode pattern via a second wire. The second electrode pattern is a pattern for a main current. The third electrode pattern is used as an auxiliary pattern for control.
Inventors:
AMI HIDEO (JP)
Application Number:
PCT/JP2023/032066
Publication Date:
May 10, 2024
Filing Date:
September 01, 2023
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L25/07; H01L21/60; H01L25/18; H02M7/48
Foreign References:
| JP2018182330A | 2018-11-15 | |||
| JPH0758272A | 1995-03-03 | |||
| JPH08191130A | 1996-07-23 | |||
| JP2019071490A | 2019-05-09 | |||
| US20170125322A1 | 2017-05-04 |
Attorney, Agent or Firm:
OHCHI INTERNATIONAL IP (JP)
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