Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2024/071244
Kind Code:
A1
Abstract:
This semiconductor module comprises a substrate, a plurality of semiconductor elements positioned on the substrate, and a control IC positioned on the substrate to control the plurality of semiconductor elements. Further, each of the plurality of semiconductor elements includes a light emitting element. An initial value of a drive current value that differs from one light emitting element to another is set in the control IC in advance.
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Inventors:
AKAHOSHI TOMOYUKI (JP)
Application Number:
PCT/JP2023/035272
Publication Date:
April 04, 2024
Filing Date:
September 27, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01S5/042; H01L33/00; H01S5/022; H01S5/02251; H01S5/40
Foreign References:
| JP2005081678A | 2005-03-31 | |||
| JP2013197131A | 2013-09-30 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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