SEMICONDUCTOR ELEMENT TRANSPORT DEVICE

WIPO Patent Application WO/2023/155411

A1

Disclosed is a semiconductor element transport device, through which intelligent workpiece machining and conveying can be achieved, manual operation is not needed, a transfer process is smooth, speed is high, efficiency is high, stability of a machining period can be guaranteed, and labor costs are saved. Furthermore, by means of providing a flipping structure, flipping of the workpiece during transfer and conveying can be achieved, solving the problem of a special workpiece needing to be flipped. The invention present can distribute different positions of various parts according to production requirements of subsequent procedures, so that modular transfer and transport are achieved, through which intelligent workpiece machining and conveying can be achieved, manual operation is not needed, the transfer process is smooth, the speed is high, the efficiency is high, the stability of the machining period can be guaranteed, and labor costs are saved. Furthermore, by means of providing the flipping structure, the flipping of the workpiece during transfer and conveying can be achieved, solving the problem of a special workpiece needing to be flipped.

ZHAO KAI (CN)
LIANG MENG (CN)
LIN HAITAO (CN)
LU SHENG (CN)
SHI WEI (CN)

PCT/CN2022/115667

August 24, 2023

August 30, 2022

Click for automatic bibliography generation  

SHANGHAI TECHSENSE CO LTD (CN)

H01L21/683; B23P21/00; H01L21/677

CN112276550A	2021-01-29
CN112249674A	2021-01-22
CN112407427A	2021-02-26
JP2001319938A	2001-11-16
CN108723052A	2018-11-02

DUAN&DUAN LAW FIRM (CN)

View/Download PDF      PDF Help

Previous Patent: SEMICONDUCTOR ELEMENT TRANSPORT DEVICE

Next Patent: SEMICONDUCTOR ELEMENT TRANSFER DEVICE