Title:
SAW BLADE CUTTING DEVICE AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/107266
Kind Code:
A1
Abstract:
[Problem] To provide a saw blade cutting device and a cutting method with which appropriate incision amounts are achieved in the middle and at both ends on a cutting surface of a workpiece and a workpiece can be cut swiftly without allowing chips to be retained between the blades of a band saw. [Solution] This saw blade cutting device is characterized by comprising: a base plate comprising a placement table on which the workpiece is placed; a gripping unit that grips the workpiece placed on the placement table; an upper frame that is capable of swinging around a swing fulcrum provided to the base plate; a saw blade member that is provided to the upper frame and cuts the workpiece; a swing mechanism that causes the upper frame to swing around the swing fulcrum; and a vertical movement mechanism that causes the saw blade member to rise when the upper frame swings around the swing fulcrum at a swinging end section thereof.
Inventors:
MOCHIZUKI HITOSHI (JP)
Application Number:
PCT/JP2020/043145
Publication Date:
May 27, 2022
Filing Date:
November 19, 2020
Export Citation:
Assignee:
SOTEC HAMAMATSU CO LTD (JP)
International Classes:
B23D53/04
Foreign References:
| JP3152124U | 2009-07-23 | |||
| US20130333536A1 | 2013-12-19 | |||
| JP2002321121A | 2002-11-05 | |||
| JP2003159701A | 2003-06-03 | |||
| EP2789437A1 | 2014-10-15 |
Attorney, Agent or Firm:
OHTA PATENT AND TRADEMARK ATTORNEYS (JP)
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