ROLLED COPPER FOIL, COPPER-CLAD LAMINATED PLATE, PRODUCTION METHOD FOR COPPER-CLAD LAMINATED PLATE, PRODUCTION METHOD FOR FLEXIBLE PRINTED CIRCUIT, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT

Title:

ROLLED COPPER FOIL, COPPER-CLAD LAMINATED PLATE, PRODUCTION METHOD FOR COPPER-CLAD LAMINATED PLATE, PRODUCTION METHOD FOR FLEXIBLE PRINTED CIRCUIT, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2024/014170

Kind Code:

A1

Abstract:

Provided is a rolled copper foil which has bending properties superior to those of conventional rolled copper foils when made into an FPC. The rolled copper foil contains at least 99.9 mass% Cu, with the balance being unavoidable impurities, and has a cube orientation area ratio of at least 94.0% as measured after being subjected to a heat treatment at a temperature of 260 °C for 30 minutes in a dryer.

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Inventors:

OTA AKIMITSU (JP)
CHO SHUNSUKE (JP)
NAKAGAWA KOTARO (JP)

Application Number:

PCT/JP2023/020559

Publication Date:

January 18, 2024

Filing Date:

June 01, 2023

Export Citation:

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Assignee:

JX METALS CORP (JP)

International Classes:

C22C9/00; C22F1/08; H05K1/02; H05K1/03; H05K1/09; C22F1/00

Foreign References:

JP2011094200A	2011-05-12
JP2000256765A	2000-09-19
JP2014214376A	2014-11-17
JP2013044005A	2013-03-04
JP2012243454A	2012-12-10

Attorney, Agent or Firm:

AXIS PATENT INTERNATIONAL (JP)

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