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Patent Searching and Data


Title:
RFID TAG MODULE EMBEDDABLE IN RUBBER
Document Type and Number:
WIPO Patent Application WO/2023/128459
Kind Code:
A1
Abstract:
The present invention relates to a RFID tag module embeddable in rubber, comprising: an RFID tag comprising an IC chip and an antenna pattern; and at least one recessed slot formed near the IC chip so as to reduce stress acting on the IC chip. The present invention has the recessed slot formed near the IC chip, and thus, even if torsional stress acts on the RFID tag as a result of high-speed driving, etc., the stress is prevented from being concentrated on the IC chip, and thus the present invention has the advantage of enabling the prevention of damage to the IC chip.

Inventors:
BONG HABIN (KR)
HWANG CHUL (KR)
JEONG INJO (KR)
KIM INJOO (KR)
KIM SANGO (KR)
YANG SEUNGHO (KR)
CHOI YECHAN (KR)
JEONG PILJUNG (KR)
RYU GILSOO (KR)
Application Number:
PCT/KR2022/020988
Publication Date:
July 06, 2023
Filing Date:
December 21, 2022
Export Citation:
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Assignee:
AMOTECH CO LTD (KR)
WILL CHEM KOREA CO LTD (KR)
International Classes:
G06K19/077; B60C19/00; C08L21/00; C08L67/02; C08L71/00; G06K19/07
Foreign References:
KR20210101623A2021-08-19
KR20200001919A2020-01-07
KR20080046816A2008-05-28
KR20170130922A2017-11-29
US20170277992A12017-09-28
Attorney, Agent or Firm:
KIM, Churchill (KR)
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